Seagate and Toshiba Bid for TDK's Core Business
2026-10-09
In 2026, Seagate Technology and Toshiba are competing to acquire TDK's hard disk drive (HDD) head business, with the deal expected to be worth billions of U.S. dollars. Toshiba was the first to approach TDK in the spring, and Seagate later joined the negotiations in the summer with a higher offer. Senior executives from the three companies recently met in Tokyo to discuss various options, including a joint venture, to secure the supply of HDD heads.
TDK's Unique Position and the Logic Behind the Bidding
TDK's technical support is particularly critical to Toshiba. TDK produces heads for the next-generation magnetic recording technologies of all three manufacturers: Seagate's heat-assisted magnetic recording (HAMR), Western Digital's energy-assisted magnetic recording (EAMR), and Toshiba's microwave-assisted magnetic recording (MAMR). Toshiba's next-generation 30TB-class drives are planned to use MAMR and later transition to HAMR. Because HAMR head development is difficult and time-consuming, TDK is a key support for both Toshiba's current products and its future roadmap. For TDK, the head business has relatively low margins and requires continuous capital investment. The company is shifting resources toward batteries, passive components, and sensors, and selling the business would free up funds for these new areas. Any acquisition, however, would face antitrust review by regulators in various countries.
SEMICONE IC Supply and Services
Stable supply of semiconductor components is also a key part of electronic system design. As an integrated circuit supplier and distributor, SEMICONE covers categories including MCUs, memory chips, motor drivers, and interface devices, and provides global sourcing and shortage solutions. Hot-selling ICs today:
● PIC18F14K50-I/SS — Microchip 8-bit PIC MCU, 16 KB flash, 768 B RAM, 15 I/O, integrated USB 2.0 full-speed interface and 10-bit ADC.
● AT45DB161E-SHD-T — Renesas 16 Mbit SPI serial flash, 2.3 V to 3.6 V wide voltage range, maximum 85 MHz clock frequency.
● DRV8706SQRHBRQ1 — TI automotive-grade H-bridge smart gate driver, integrated two half-bridge driver channels, capable of driving high-side and low-side N-channel power MOSFETs.
● L6362ATR — ST IO-Link device transceiver, compatible with PHY2 three-wire connection, supports COM1/COM2/COM3 communication rates.
● 1N4448WS-7-F — Diodes Incorporated high-speed switching diode, 75 V reverse voltage, 250 mA average rectified current, reverse recovery time of only 4 ns.
Email: info@semicone.com
Cirrus Logic Completes Acquisition of INVENTVM
Related Article
Cirrus Logic buys Italy's INVENTVM to strengthen mixed-signal, power, and audio capabilities, expanding its European R&D footprint.
Cirrus Logic Completes Acquisition of INVENTVM
Current sense amplifiers turn tiny shunt-resistor drops into precise voltage outputs. Learn high/low-side sensing, key specs, and top CSA models.
Current Sense Amplifier: A Complete Guide from Principles to Selection