TSMC and Amkor Sign Decade-Long Agreement

2026-06-23

On June 16, 2026, TSMC and Amkor, the largest semiconductor packaging and testing company in the United States, jointly announced that they have signed a ten-year cooperation agreement. This marks the first time TSMC has publicly disclosed a long-term agreement with a partner spanning a full decade. Amkor stated that TSMC will procure packaging and testing services from the company, establishing a long-term and stable cooperative framework between the two parties.

TSMC and Amkor Sign Decade-Long Agreement

Under the agreement, TSMC will purchase advanced packaging and testing services from Amkor. Both parties will jointly define the packaging technology roadmap, covering TSMC's advanced packaging technologies such as Integrated Fan-Out (InFO) and CoWoS, to meet the capacity demands of their mutual customers. Industry observers widely believe that this collaboration signals the two industry leaders will join forces to build a "U.S.-based end-to-end manufacturing" ecosystem spanning from wafer production to final packaging and testing, thereby constructing a more integrated and resilient semiconductor supply chain.

Capacity Deployment

TSMC plans to leverage the one-stop advanced packaging and testing services provided by Amkor's new facility under construction in Peoria, Arizona, to support its customers—particularly those producing chips at TSMC's advanced wafer fabrication plant in Phoenix. Amkor's new plant covers 104 acres with an investment of $2 billion, is expected to begin production in early 2028, and will create approximately 2,000 jobs. With TSMC's front-end wafer fab and Amkor's back-end packaging and testing facility located in close proximity within Arizona, this tight collaboration will significantly shorten the overall product manufacturing cycle, eliminating the previous need to ship wafers back to Asia for packaging and testing—a process that previously took several weeks—and enabling faster time-to-market.

Strategic Significance

Currently, demand for high-performance computing and artificial intelligence is accelerating rapidly, and advanced packaging has become a critical enabling technology for system-level performance and integration. Kevin Zhang, Senior Vice President of Business Development and Global Sales at TSMC, stated that the two companies have a long history of cooperation in the global advanced packaging arena, and he is confident that this U.S.-based collaboration will be successful. Amkor CEO Giel Rutten noted that customers will be able to obtain a complete U.S.-based supply chain service in Arizona, ranging from advanced silicon wafer manufacturing to completed testing and packaging.

This cooperation not only strengthens Arizona's advanced semiconductor packaging capabilities but will also accelerate investment in the U.S. semiconductor supply chain ecosystem, driving the formation of a closed-loop domestic semiconductor manufacturing system in the United States and delivering a more efficient and mutually beneficial operating model for customers.

SEMICONE Independent IC Distributor

SEMICONE is a distributor of semiconductors, specializing in providing high-quality, original components such as memory, MOSFETs, IGBTs, diodes, passive components, and connectors to global customers. SEMICONE is committed to providing electronic component supply solutions for customers, covering material sourcing, domestic alternative components, BOM ordering, and other services. The latest popular general component models are as follows.

● BSC026N08NS5: Infineon's OptiMOS 5 series 80V N-channel power MOSFET, suitable for DC-DC converters, motor drives, and power management applications.

● AD5362BSTZ: ADI's 16-channel, 14-bit voltage output DAC, widely used in industrial automation, instrumentation, and process control systems.

● MX25U6435FM2I-10G: Wan Hong Electronics' 64Mb serial NOR Flash memory, used for code storage, firmware upgrade, and embedded system data storage scenarios.

● IPZ40N04S5L-7R4: Infineon's OptiMOS 5 series 40V N-channel power MOSFET, optimized for high-current load switches, battery management, and synchronous rectification applications.

● TPSI3052QDWZRQ1: Texas Instruments' isolated solid-state relay driver compliant with AEC-Q100 automotive standards, suitable for electric vehicle battery management systems and industrial isolation control applications.

Email: info@semicone.com

SEMICONE Hot Chip Solution Analysis: Application Scenarios & Spot Supply

Aluminum Capacitor Prices Surge, Nichicon Announces Across-the-Board Price Hike