Power Semiconductor Price Hikes: onsemi's October Adjustment Takes Effect

2026-09-23

onsemi recently issued a price adjustment notice to customers, announcing price changes across a broad range of its product lines, effective October 10, 2026. This is the company's second price adjustment in 2026; the first notice was issued in March and implemented on April 1, with less than half a year between the two rounds.

In the notice, onsemi stated that this round is mainly driven by continued increases in raw material, manufacturing, energy, and infrastructure costs, combined with growing downstream demand from power supply, industrial, and data center markets. The notice did not uniformly disclose all affected part numbers and specific increases; actual adjustment magnitudes and bills of materials will be communicated to customers individually by authorized onsemi distributors.

Industry-Wide Relay of Price Hikes

Power Semiconductor Price Hikes: onsemi's October Adjustment Takes Effect

Since 2026, major global power semiconductor players have carried out multiple rounds of price adjustments. Infineon completed two rounds within the year: the first round raised power switch product prices by 5% to 15%, and the second took effect on July 1. Texas Instruments (TI) notified customers of price adjustments based on materials, technology, and manufacturing processes. Renesas announced a price adjustment plan on September 9, with new prices to take effect in January 2027, also its second adjustment of the year. Among domestic manufacturers, China Resources Micro launched its second full-category price increase of the year in July, with increases starting at 15%. Yangjie Technology simultaneously raised prices across its full product series by 10% to 15%.

Supply-Demand Structural Shift

Behind the price hikes, demand-side changes are more fundamental. AI computing cluster power consumption has surged, and power semiconductors are becoming the industry's next growth engine after memory. Technically, as AI server rack power continues to climb, power architecture is evolving toward high-voltage DC distribution. Taking the new-generation 800V architecture as an example, power is converted through multiple stages down to about 48V, then further converted to the approximately 1V low voltage required by AI chips. From high-voltage distribution and power conversion to chip power delivery, requirements for high-voltage, high-current, and high-efficiency power devices are rising simultaneously across every stage.

The supply side is also under pressure. AI-related demand continues to increase its occupation of 8-inch mature-node capacity, squeezing available capacity for traditional applications, while power semiconductor companies, constrained by fierce competition over the past two years, have no large-scale capacity expansion plans for now. Original manufacturer order lead times continue to extend.

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