U.S. Memory Chip Manufacturing: The Capacity Race Between Micron and SK hynix
2026-09-18
In September 2026, Micron Technology and SK hynix are accelerating their respective U.S. local manufacturing plans, with a race for advanced memory capacity unfolding simultaneously in Idaho, New York, and Indiana.
Micron Advances on Two Fronts
Meanwhile, Micron's four-fab manufacturing complex in Clay, New York, is also advancing, with New York State providing up to $5.5 billion in additional GREEN CHIPS incentives. Micron plans to invest more than $250 billion cumulatively in the U.S. by 2035 and has explicitly set a goal of increasing the share of U.S.-based DRAM capacity to 40%. Construction of the second Idaho fab began in 2026 and is expected to begin operations by the end of 2028.
SK hynix: Packaging and Front-End Manufacturing
SK hynix has chosen a different entry point for U.S. local manufacturing. Its first U.S. plant, located at the Purdue Research Park in West Lafayette, Indiana, represents a total investment of more than $4 billion and is positioned as an advanced packaging production base for AI-oriented memory, rather than front-end wafer manufacturing. The plant is expected to complete cleanroom construction in October 2028 and begin volume production of next-generation HBM in the second half of 2029. Its operating model is as follows: advanced wafers produced in Korea are shipped to Indiana for packaging and testing, after which U.S.-made HBM products are supplied directly to U.S. customers. The site will also build an advanced packaging R&D and test platform, and more than 100 partners in materials, components, and equipment are in talks to move in.
On the front-end manufacturing side, SK hynix is in talks with Intel about the possibility of producing memory chips in the U.S. for the first time. According to reports, one option is for SK hynix to lease part of Intel's chip manufacturing facilities in Ohio, while another is to form a joint venture with Intel and major cloud service companies. However, SK hynix has issued a statement clarifying that no specific plans have been confirmed and that the negotiations remain exploratory.
Memory Talent Bottleneck
Whether in front-end manufacturing or advanced packaging, both companies face the same structural challenge: a severe shortage of U.S. memory chip engineering talent. According to a recent report by McKinsey and the SEMI Foundation, by 2030 the U.S. semiconductor industry could face a shortage of up to 157,000 skilled workers, with the largest gap in engineering positions; an additional 88,000 engineering professionals are expected to be needed.
SEMICOEN: A Reliable IC Supply Partner
SEMICOEN is a spot IC distributor focused on obsolete part searches, urgent components, alternative models, and long-term supply services. Leveraging deep coverage of product lines from popular brands such as Nexperia, ST, TI, Murata, ADI, and Microchip, it provides fast inventory response and competitive pricing.
| Part Number | Type | Key Parameters | Typical Applications |
| BAS321-QF | General-purpose switching diode | 200 V/250 mA, SOD-323, trr 50 ns | High-frequency switching, signal rectification |
| TPD4E1U06DCKR | Four-channel ESD protection diode | 0.8 pF, ±15 kV, SC70-6 | HDMI, USB 2.0, DisplayPort |
| STM32G491KEU6 | Cortex-M4 MCU | 170 MHz, 512 KB Flash, UFQFPN32 | Motor control, digital power |
| STM32L051C8T6 | Cortex-M0+ MCU | 32 MHz, 64 KB Flash, LQFP48 | Ultra-low-power sensor nodes |
| GRM31CC72A475KE1 | MLCC capacitor | 4.7 µF, 100 V, X7S, 1206 | Power filtering, decoupling |
Email: info@semicone.com
onsemi EPP Platform: Reconstructing Power Packaging Architecture with 12-Inch Silicon Wafers
Related Article
onsemi EPP uses 12-inch silicon wafers to package SiC/GaN power chips, eliminating wire bonding. It cuts AI breaker size 50% and EV loss 15%.
onsemi EPP Platform: Reconstructing Power Packaging Architecture with 12-Inch Silicon Wafers
ASML eyes 110 EUV units by 2028; 2027 sold out. AI drives TSMC, Samsung, Intel demand. Tech upgrades boost output.
ASML EUV Lithography Expansion: 2028 Capacity Target of 110 Units
