ASML EUV Lithography Expansion: 2028 Capacity Target of 110 Units
2026-09-16
Customer Demand Surges
ASML's EUV lithography machine customers mainly include TSMC, Samsung Electronics, and Intel. Against the backdrop of continued explosive growth in AI chip demand, the capacity expansion plans of these three advanced-process manufacturers are accelerating. Christophe Fouquet, President and CEO of ASML, noted at the company's Q1 2026 earnings call that customers are accelerating their capacity expansion plans for 2026 and the long term, and that in recent months they have raised their short- and medium-term demand expectations for ASML products. In memory chips, customers said that 2026 is already undersupplied, and that this situation will continue beyond 2026. In advanced logic chips, customers are expanding capacity for different process nodes.
It is worth noting that NVIDIA itself does not directly manufacture most GPUs, but instead relies on foundries including TSMC to produce chips, and the key equipment used by these advanced chip manufacturers is precisely the EUV lithography machines supplied by ASML. Therefore, ASML's capacity expansion progress, to some extent, determines the upper limit of global AI compute chip supply.
Technology Upgrades
While expanding capacity, ASML is also continuously advancing the iterative upgrading of lithography technology. In light source technology, ASML has successfully upgraded its tin droplet generator technology, doubling the number of tin droplets to about 100,000 per second, and increasing light source power from 600W to 1,000W. The upgraded equipment can process about 330 wafers per hour, compared with 220 at present, and is expected to increase chip output by 50% by 2030.
In next-generation High NA EUV, ASML has announced cooperation with three leading advanced-process companies—Samsung Electronics, TSMC, and Intel—to jointly promote the transition of High NA EUV lithographic patterning systems from traditional 6-inch masks to 12-inch masks, in order to improve machine productivity and resolve the stitching issue in the current approach.
SEMICONE IC Components Supply Services
Downstream in the semiconductor industry chain, SEMICONE, as a professional integrated circuit component supplier and distributor, serves customers in industrial control, communications equipment, and embedded systems, providing genuine IC in-stock supply and one-stop BOM supporting services, helping customers solve procurement challenges with fast delivery and genuine-product traceability. Today's hot-selling featured components are as follows:
● LT6370IS8E#PBF (Analog Devices) — zero-drift instrumentation amplifier, ultra-low offset voltage and low temperature drift, SOIC-8 package, suitable for precision sensor signal conditioning and industrial measurement systems.
● SI7461DP-T1-E3 (Vishay) — P-channel MOSFET, 60V/14.4A, 14.5mΩ low on-resistance, PowerPAK SO-8 package, suitable for high-side switching and power management.
● TPS53622ARSBR (TI) — multiphase power controller, dual-channel VR13 SVID compatible, D-CAP+ architecture, built-in NVM and PMBus, QFN-40 package, designed for server VCCIO/VMCP.
● STM8S207CBT6 (ST) — 8-bit MCU, 128KB Flash/6KB RAM, 24MHz main frequency, LQFP-48 package, integrated CAN/SPI/I2C/UART, industrial-grade reliability.
Email: info@semicone.com
Samsung Electro-Mechanics and Qualcomm Develop Organic-Bridge 2.1D Packaging
Related Article
Samsung & Qualcomm develop organic-bridge 2.1D packaging, replacing silicon bridges to cut costs and avoid Intel EMIB patents.
Samsung Electro-Mechanics and Qualcomm Develop Organic-Bridge 2.1D Packaging
Discover popular IC and power components for automotive and industrial systems, with SEMICONE supporting BOM matching, inventory sourcing and component procurement.
Hot-Selling IC Components: Automotive Electronics, Power and High-Performance Devices
