Samsung Electro-Mechanics and Qualcomm Develop Organic-Bridge 2.1D Packaging
2026-09-15
As demand for heterogeneous integration in AI compute chips continues to rise, advanced packaging is becoming a new focal point of competition in the semiconductor industry. Samsung Electro-Mechanics and Qualcomm are jointly developing a 2.1D advanced packaging technology for AI semiconductors, using embedded organic bridge dies to replace traditional silicon bridges and providing a more cost-competitive solution for multi-chip interconnection. It is reported that the two parties have carried out more than a year of R&D and reliability certification work on this technology platform.
Technical Principle
Samsung Electro-Mechanics' approach embeds an organic bridge die with 5 to 7 RDL layers into a grooved FC-BGA substrate, targeting line width and spacing reduced to 1.5 to 2 microns, via sizes of 4 to 5 microns, and die-to-die pattern density of 500 to 1,000 connections per millimeter. Compared with buildup circuitry in traditional FC-BGA substrates, this ultrafine wiring can transmit more signals within a smaller area, thereby improving I/O density and bandwidth between high-compute chips such as GPUs and HBM.
Industry Drivers
The choice of an organic material route is backed by clear industrial logic. Intel has mass-produced EMIB since 2017 and accumulated deep patent barriers around silicon bridges. By replacing silicon bridges with organic materials, Samsung Electro-Mechanics can reduce manufacturing costs on the one hand and effectively avoid EMIB-related intellectual property held by Intel on the other.
On Qualcomm's side, the company filed a patent for "interconnect bridge" technology as early as October 2024, and in March 2026 recruited relevant R&D personnel in Korea, showing a clear intention to position itself for large multi-chip semiconductor applications in data centers. Samsung Electro-Mechanics is also advancing the development of organic-bridge-based 2.1D packaging substrates with several other customers simultaneously, and is collaborating with Samsung Electronics' foundry division on packaging evaluation.
SEMICONE Component Support
As an integrated circuit component supplier and distributor, SEMICONE relies on a comprehensive global procurement network and a genuine IC traceability system to provide industrial and communications customers with in-stock supply and BOM support services for MOSFETs, MCUs, power management ICs, and FPGAs, helping solve customers' supply challenges with fast delivery capabilities. Today's hot-selling featured components are as follows:
● PIC12LF1822-I/SN (Microchip) — 8-bit PIC MCU, 3.5KB Flash, 32MHz main frequency, SOIC-8 package, low-power XLP technology, suitable for sensor nodes and portable devices.
● TMUX1208RSVR (TI) — 5V bidirectional 8:1 single-channel analog multiplexer, on-resistance only 5Ω, UQFN-16 package, suitable for signal switching and data acquisition systems.
● 5SGSMD5H3F35I3N (Intel) — Stratix V GS series FPGA, 457K logic elements, 552 I/Os, 1152-FBGA package, suitable for high-performance computing and communications infrastructure.
● RC19016A100GN1 (Renesas) — PCIe Gen5/Gen6 fanout buffer, additive phase jitter as low as 4 fs RMS, 16 outputs, VFQFPN-64 package, suitable for high-speed clock distribution and data center interconnect.
Email: info@semicone.com
Hot-Selling IC Components: Automotive Electronics, Power and High-Performance Devices
Related Article
Discover popular IC and power components for automotive and industrial systems, with SEMICONE supporting BOM matching, inventory sourcing and component procurement.
Hot-Selling IC Components: Automotive Electronics, Power and High-Performance Devices
Renesas raises prices again; new rates start Jan 1, 2027. Cost inflation and AI data center buildout boost power chip demand. Secure high-demand parts with SEMICONE.
Renesas Raises Prices Again This Year: New Prices Take Effect in 2027
