Model No: 5SGSMD5H3F35I3N
Altera 5SGSMD5H3F35I3N
Manufacturer: Altera
SEMICON NO.: 5SGSMD5H3F35I3N
Package: 1152-FBG
Stock: In stock
Description: Stratix V GS FPGA 457,000 552 I/O
SEMICON NO.: 5SGSMD5H3F35I3N
Package: 1152-FBG
Stock: In stock
Description: Stratix V GS FPGA 457,000 552 I/O
Quantity :
| Mfr | Altera |
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Stratix® V GS |
| Logic Elements (LEs) / Cells | 457,000 |
| Logic Array Blocks (LABs) / CLBs | 172,600 |
| Adaptive Logic Modules (ALMs) | 172,600 |
| Total RAM Bits | 39,936,000 bits (≈39.9 Mbit) |
| Block RAM (M9K Blocks) | 2,014 |
| Dedicated 18x18 Multipliers | 3,180 |
| DSP Blocks | 1,590 |
| PCIe Hard IP Blocks | 1 |
| Maximum User I/O Pins | 552 |
| Number of Transceiver Blocks | 36 |
| Transceiver Data Rate (Max) | 14.1 Gb/s |
| Core Supply Voltage | 0.82 V to 0.88 V |
| I/O Voltage Standards | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | -40°C to +100°C |
| Package | 1152-FBG |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
The 5SGSMD5H3F35I3N is a high-density Stratix V GS FPGA from Intel (Altera), manufactured on 28nm process technology and housed in a 1152-pin FC-FBGA surface-mount package. It integrates 457,000 logic elements, supports 0.85V core supply, and is specified for extended industrial operating temperature range, making it a high-performance reconfigurable computing solution for high-throughput communication, defense signal processing, and high-end industrial embedded systems that demand massive parallel processing capability.
Key Features and Highlights
● 457,000 High-Density Logic Elements: Massive 457K adaptive logic resources deliver industry-leading parallel processing throughput, supporting complex custom logic, multi-core soft processor implementation, and large-scale DSP acceleration on a single chip.
● 28nm Advanced Process Technology: 28nm high-performance manufacturing process balances high logic density with optimized power consumption, drastically reducing core dynamic power dissipation compared to older 40nm FPGA generations.
● Extended Industrial Temperature Rating: Fully specified for wide industrial operating temperature range, maintaining stable high performance in harsh outdoor, near-equipment high-temperature, and defense deployment environments.
● 1152-Pin FC-FBGA High-I/O Package: Abundant user I/O resources support simultaneous interfacing with multiple high-speed memory chips, high-speed ADC/DAC arrays, and multi-channel high-speed serial communication peripherals.
● 457,000 High-Density Logic Elements: Massive 457K adaptive logic resources deliver industry-leading parallel processing throughput, supporting complex custom logic, multi-core soft processor implementation, and large-scale DSP acceleration on a single chip.
● 28nm Advanced Process Technology: 28nm high-performance manufacturing process balances high logic density with optimized power consumption, drastically reducing core dynamic power dissipation compared to older 40nm FPGA generations.
● Extended Industrial Temperature Rating: Fully specified for wide industrial operating temperature range, maintaining stable high performance in harsh outdoor, near-equipment high-temperature, and defense deployment environments.
● 1152-Pin FC-FBGA High-I/O Package: Abundant user I/O resources support simultaneous interfacing with multiple high-speed memory chips, high-speed ADC/DAC arrays, and multi-channel high-speed serial communication peripherals.
Compatible Alternative FPGA Part List
1. 5SGSMD5H3F35C3N: The commercial 0°C to 70°C temperature grade variant of the same FPGA, offering lower cost for indoor telecom and lab test equipment deployment scenarios.
2. XC7VX485T-2FFG1157C: A Xilinx Virtex-7 FPGA, serving as a fully cross-vendor second-source alternative with comparable logic density and high-speed signal processing performance.
3. 5SGSMD6H3F35I3N: The higher-density Stratix V GS variant, integrating over 600K logic elements for ultra-large-scale high-throughput signal processing system upgrades.
4. 1SX280HH1F43E2LG: An Intel Agilex high-end FPGA, featuring advanced 10nm process and higher transceiver speed for next-generation 400G/800G communication system applications.
1. 5SGSMD5H3F35C3N: The commercial 0°C to 70°C temperature grade variant of the same FPGA, offering lower cost for indoor telecom and lab test equipment deployment scenarios.
2. XC7VX485T-2FFG1157C: A Xilinx Virtex-7 FPGA, serving as a fully cross-vendor second-source alternative with comparable logic density and high-speed signal processing performance.
3. 5SGSMD6H3F35I3N: The higher-density Stratix V GS variant, integrating over 600K logic elements for ultra-large-scale high-throughput signal processing system upgrades.
4. 1SX280HH1F43E2LG: An Intel Agilex high-end FPGA, featuring advanced 10nm process and higher transceiver speed for next-generation 400G/800G communication system applications.
