Micron: Seek New Production Facilities, Expand High Bandwidth Memory (HBM) scale

2024-08-29

Micron Seeks New HBM Production Facilities

Micron Technology is actively expanding its production facility in Taiwan to enhance its High bandwidth memory (HBM) production capacity. According to the latest reports, Micron has agreed to buy three LCD factories in Taichung from Taiwanese display manufacturer AUO in a deal worth up to NT $8.1 billion (US $253.3 million). In addition, through this acquisition, Micron plans to use these facilities to focus on front-end wafer testing and support the continued expansion of its DRAM production facilities in Taichung and Taoyuan.

Micron's expansion plan for HBM memory is due to the high demand for such high-performance memory for AI applications. Market players noted that the growing demand for HBM memory, especially from companies like NVIDIA, has prompted Micron to accelerate its penetration in the HBM market and plan to increase its HBM product line market share to 20 to 25 percent by the end of 2025.

In addition, Micron is considering adding HBM production capacity in the United States and Malaysia. In Taiwan, Micron has undertaken a major expansion of its HBM production facility in Taichung to increase its production capacity. In Japan, Micron plans to build a new DRAM plant in Hiroshima, which is expected to begin construction in early 2026, complete plant construction and first equipment installation by the end of 2027, and will initially focus on the production of DRAM, including HBM products.

Although Micron had been interested in buying another Innolux factory in Tainan, it was eventually acquired by TSMC for NT $17.14 billion. However, Micron has not given up on its plans to build a facility in Tainan, and according to industry sources, Micron is still in talks with Innolux about the Tainan site and has started planning for the follow-up.

Micron has accelerated the development and production of advanced memory technologies such as the HBM3E through the acquisition of plant assets. With its high bandwidth, large capacity and low power consumption, HBM3E memory meets the stringent memory requirements of AI and high-performance computing, especially in supporting large language models and complex computing tasks. At the same time, by establishing or expanding production bases in key regions around the world, Micron can be closer to its key customers, such as AI computing chip manufacturers such as Nvidia, ensuring supply chain stability and meeting customer customization needs. And by investing more, Micron aims to maintain its technology leadership and position itself well in the broader storage solutions market.

Overall, Micron's aggressive search for new production facilities to scale up HBM memory production demonstrates its commitment to strengthen HBM memory production capacity globally to meet the growing market demand for high-performance memory, especially in AI and high-performance computing.

About Micron

Micron Technology, Inc., founded in 1978 and headquartered in Boise, Idaho, is a world-renowned manufacturer of semiconductor memory and imaging products. Micron is known for its advanced manufacturing technologies in product areas such as DRAM, NAND flash memory and CMOS image sensors. The company's products are widely used in mobile devices, computers, servers, network equipment, security, industrial, consumer electronics, and medical devices, providing high-performance memory and storage solutions for these diverse applications. Micron offers a broad portfolio of high-performance memory and storage products, including DRAM, NAND and NOR, under the Micron® and Crucial® brands.

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