Model No: THGBMHG8C2LBAIL
Kioxia America Inc. THGBMHG8C2LBAIL
Manufacturer: Kioxia America Inc.
SEMICON NO.: THGBMHG8C2LBAIL
Package: 153-WFBGA
Stock: In stock
Description: IC Embedded Flash Memory 32G × 8 eMMC
SEMICON NO.: THGBMHG8C2LBAIL
Package: 153-WFBGA
Stock: In stock
Description: IC Embedded Flash Memory 32G × 8 eMMC
Quantity :
| Mfr | Kioxia America Inc. |
| Device Family | e•MMC™ |
| Device Type | Embedded Flash Memory |
| Memory Size / Density | 256 Gbit / 32 GB |
| Memory Organization | 32G × 8 |
| Memory Technology | FLASH - NAND |
| Interface Type | eMMC |
| Max Clock Frequency | 52 MHz |
| Supply Voltage (Vcc) | 2.7 V to 3.6 V |
| Operating Temperature | -25°C to +85°C |
| Package | 153-WFBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
THGBMHG8C2LBAIL 32GB eMMC 5.1 NAND Flash Memory
The THGBMHG8C2LBAIL, manufactured by Kioxia (formerly Toshiba Memory), is a high‑capacity, high‑performance embedded Multi‑Media Card (eMMC) integrating 32GB (256Gb) of 15nm NAND flash and an onboard controller in a compact 153‑ball WFBGA package. Compliant with JEDEC eMMC 5.1 standard, it operates at up to 52MHz clock frequency, supports 1/4/8‑I/O data transfer modes, and delivers reliable non‑volatile storage for embedded systems with industrial temperature tolerance (‑25°C to +85°C). As a fully managed NAND solution, it eliminates external controller complexity while ensuring robust data integrity for cost‑sensitive, space‑constrained designs.
The THGBMHG8C2LBAIL serves as a mainstream storage solution across embedded and consumer electronics:
● Smartphones and tablets for boot storage, OS, and multimedia content
● Industrial embedded systems (PLCs, HMI, data loggers) requiring high reliability and wide temperature support
● Smart home devices (IP cameras, voice assistants, smart TVs) for local video/audio/data storage
● Automotive infotainment and telematics systems needing robust, vibration‑resistant storage
● Medical devices, point‑of‑sale terminals, and portable gadgets prioritizing small form factor and low power.
AlternativeeMMC Components
● Samsung KLM8G1GEME‑B041: 32GB eMMC 5.1 flash memory with 52MHz clock, 8‑I/O support, and industrial temperature range for cross‑platform compatibility.
● Micron MTFC32GAPAL‑IT: 32GB eMMC 5.0 device with integrated ECC, 153‑ball WFBGA package, and low‑power operation for cost‑sensitive embedded designs.
● SK Hynix H26M31001FMR: 32GB eMMC 5.1 NAND flash with high‑speed 8‑I/O interface, robust wear‑leveling, and automotive‑grade reliability for infotainment systems.
● Toshiba THGBMJG6C1LBAIL: 64GB eMMC 5.1 variant with 15nm NAND, 153‑ball WFBGA package, and backward compatibility for higher‑capacity upgrade paths.
The THGBMHG8C2LBAIL, manufactured by Kioxia (formerly Toshiba Memory), is a high‑capacity, high‑performance embedded Multi‑Media Card (eMMC) integrating 32GB (256Gb) of 15nm NAND flash and an onboard controller in a compact 153‑ball WFBGA package. Compliant with JEDEC eMMC 5.1 standard, it operates at up to 52MHz clock frequency, supports 1/4/8‑I/O data transfer modes, and delivers reliable non‑volatile storage for embedded systems with industrial temperature tolerance (‑25°C to +85°C). As a fully managed NAND solution, it eliminates external controller complexity while ensuring robust data integrity for cost‑sensitive, space‑constrained designs.
The THGBMHG8C2LBAIL serves as a mainstream storage solution across embedded and consumer electronics:
● Smartphones and tablets for boot storage, OS, and multimedia content
● Industrial embedded systems (PLCs, HMI, data loggers) requiring high reliability and wide temperature support
● Smart home devices (IP cameras, voice assistants, smart TVs) for local video/audio/data storage
● Automotive infotainment and telematics systems needing robust, vibration‑resistant storage
● Medical devices, point‑of‑sale terminals, and portable gadgets prioritizing small form factor and low power.
AlternativeeMMC Components
● Samsung KLM8G1GEME‑B041: 32GB eMMC 5.1 flash memory with 52MHz clock, 8‑I/O support, and industrial temperature range for cross‑platform compatibility.
● Micron MTFC32GAPAL‑IT: 32GB eMMC 5.0 device with integrated ECC, 153‑ball WFBGA package, and low‑power operation for cost‑sensitive embedded designs.
● SK Hynix H26M31001FMR: 32GB eMMC 5.1 NAND flash with high‑speed 8‑I/O interface, robust wear‑leveling, and automotive‑grade reliability for infotainment systems.
● Toshiba THGBMJG6C1LBAIL: 64GB eMMC 5.1 variant with 15nm NAND, 153‑ball WFBGA package, and backward compatibility for higher‑capacity upgrade paths.
