Model No: IS43TR16512BL-107MBLI
ISSI IS43TR16512BL-107MBLI
Manufacturer: ISSI
SEMICON NO.: IS43TR16512BL-107MBLI
Package: 96-TWBGA
Stock: In stock
Description: DDR3L Memory IC 8Gbit Parallel 933MHz 20ns
SEMICON NO.: IS43TR16512BL-107MBLI
Package: 96-TWBGA
Stock: In stock
Description: DDR3L Memory IC 8Gbit Parallel 933MHz 20ns
Quantity :
| Mfr | ISSI |
| Product Series | SDRAM - DDR3L Memory IC |
| Product Family | IS43/46TR16512B |
| Memory Size / Density | 8 Gbit |
| Memory Organization | 512M x 16 |
| Memory Format | DRAM |
| Memory Type | Volatile |
| Clock Frequency (Max) | 933 MHz |
| Supply Voltage (VDD/VDDQ) | 1.283 V to 1.45 V |
| Active Current (IDD0) | 93 mA |
| Operating Temperature | -40°C to +95°C |
| Package | 96-TWBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
IS43TR16512BL-107MBLI 8Gb DDR3L SDRAM memory IC
The IS43TR16512BL-107MBLI, manufactured by Integrated Silicon Solution (ISSI), is an 8Gb (512M×16) DDR3L SDRAM memory IC housed in a compact 96-ball TWBGA package (10×14mm), optimized for low-voltage, high-speed data storage in space-constrained systems. Operating at a nominal 1.35V supply (1.283V to 1.45V range), it delivers a maximum clock frequency of 933MHz (1866MT/s data rate) with a 16-bit wide data bus, supporting high-bandwidth data transfer for embedded, industrial, and consumer electronics. Built with eight internal banks and an 8n-bit prefetch architecture, it ensures efficient concurrent operation and fast access times while maintaining low power consumption, making it ideal for battery-powered and thermally sensitive applications.
This DDR3L SDRAM integrates low-voltage core and I/O circuitry, reducing active current to 93mA and refresh current to 39mA, with support for auto self-refresh (ASR) and self-refresh temperature (SRT) modes to optimize power efficiency across temperatures. It offers programmable CAS latency, additive latency, and burst length (4 or 8), alongside on-the-fly burst length switching and auto-precharge for flexible memory management.
The IS43TR16512BL-107MBLI is widely utilized in embedded systems, industrial controls, and IoT devices requiring high-density, low-voltage memory, including single-board computers, medical devices, and automotive infotainment systems. It excels in portable electronics such as tablets and wearables, where its low power draw and compact package extend battery life and save board space. Additionally, it serves in networking equipment, solid-state drives (SSDs), and edge computing devices, providing stable, high-speed data storage for processors, FPGAs, and data-intensive applications.
Alternative SDRAMs
1. MT40A512M16HA-083E:B (Micron): An 8Gb DDR3L SDRAM with 933MHz clock, 1.35V operation, and 96-ball BGA package, offering pin-compatible high-speed performance for embedded systems.
2. K4B8G1646D-MYK0 (Samsung): A 512M×16 DDR3L memory IC with 1866MT/s data rate, low power consumption, and industrial temperature range, ideal for portable and industrial designs.
3. NT5CC512M16DP-DI (Nanya): An 8Gb DDR3L SDRAM featuring 933MHz frequency, 1.35V supply, and auto-refresh modes, providing cost-effective high-density storage for IoT devices.
4. W631GG8MB-12 (Winbond): A 512M×16 DDR3L memory chip with 1866MT/s speed, low operating current, and compact BGA package, suitable for consumer and embedded applications.
Semicone specializes in sourcing hard-to-find and shortage ICs, offering reliable shortage component solutions and comprehensive BOM list services to keep production lines running. With a global supplier network and strict quality control, Semicone provides genuine, tested parts for urgent and long-term orders, mitigating supply chain risks for high-density DDR3L memory applications.
The IS43TR16512BL-107MBLI, manufactured by Integrated Silicon Solution (ISSI), is an 8Gb (512M×16) DDR3L SDRAM memory IC housed in a compact 96-ball TWBGA package (10×14mm), optimized for low-voltage, high-speed data storage in space-constrained systems. Operating at a nominal 1.35V supply (1.283V to 1.45V range), it delivers a maximum clock frequency of 933MHz (1866MT/s data rate) with a 16-bit wide data bus, supporting high-bandwidth data transfer for embedded, industrial, and consumer electronics. Built with eight internal banks and an 8n-bit prefetch architecture, it ensures efficient concurrent operation and fast access times while maintaining low power consumption, making it ideal for battery-powered and thermally sensitive applications.
This DDR3L SDRAM integrates low-voltage core and I/O circuitry, reducing active current to 93mA and refresh current to 39mA, with support for auto self-refresh (ASR) and self-refresh temperature (SRT) modes to optimize power efficiency across temperatures. It offers programmable CAS latency, additive latency, and burst length (4 or 8), alongside on-the-fly burst length switching and auto-precharge for flexible memory management.
The IS43TR16512BL-107MBLI is widely utilized in embedded systems, industrial controls, and IoT devices requiring high-density, low-voltage memory, including single-board computers, medical devices, and automotive infotainment systems. It excels in portable electronics such as tablets and wearables, where its low power draw and compact package extend battery life and save board space. Additionally, it serves in networking equipment, solid-state drives (SSDs), and edge computing devices, providing stable, high-speed data storage for processors, FPGAs, and data-intensive applications.
Alternative SDRAMs
1. MT40A512M16HA-083E:B (Micron): An 8Gb DDR3L SDRAM with 933MHz clock, 1.35V operation, and 96-ball BGA package, offering pin-compatible high-speed performance for embedded systems.
2. K4B8G1646D-MYK0 (Samsung): A 512M×16 DDR3L memory IC with 1866MT/s data rate, low power consumption, and industrial temperature range, ideal for portable and industrial designs.
3. NT5CC512M16DP-DI (Nanya): An 8Gb DDR3L SDRAM featuring 933MHz frequency, 1.35V supply, and auto-refresh modes, providing cost-effective high-density storage for IoT devices.
4. W631GG8MB-12 (Winbond): A 512M×16 DDR3L memory chip with 1866MT/s speed, low operating current, and compact BGA package, suitable for consumer and embedded applications.
Semicone specializes in sourcing hard-to-find and shortage ICs, offering reliable shortage component solutions and comprehensive BOM list services to keep production lines running. With a global supplier network and strict quality control, Semicone provides genuine, tested parts for urgent and long-term orders, mitigating supply chain risks for high-density DDR3L memory applications.
