ST Implements Third Price Hike This Year, Effective August 23
2026-08-20
On August 18, 2026, MCU and power semiconductor leader STMicroelectronics (ST) issued another price‑increase notice to customers, announcing that prices for multiple product lines would be raised effective August 23. This marks ST's third price adjustment in 2026, following previous hikes on April 26 and June 28.
ST's Three Rounds of Price Increases
Second round – announced on May 28, effective June 28. This round extended the price adjustments to remaining products not covered in the first round, encompassing a broad range of items such as general‑purpose MCUs, power ICs, and NFC RFID chips. With two consecutive hikes within just two months, downstream customers in industrial, automotive, and consumer electronics already felt notable cost pressures.
Third round – effective August 23. ST cited sustained strong semiconductor demand across multiple segments for several consecutive quarters, along with significant cost increases throughout the entire supply chain – including transportation, energy, raw materials, and manufacturing services. Specific percentage increases and affected part numbers are being communicated individually by account managers; the notice did not disclose uniform figures.
Market feedback indicates that automotive‑grade MCUs are among the most supply‑constrained categories in this round, with some ST automotive MCU part numbers seeing price increases of 15% to 20%. For power devices, lead times have generally extended beyond 30 weeks, with certain parts reaching up to 52 weeks.
Industry‑Wide Semiconductor Price Trends
ST's three rounds of price hikes are part of a broader global semiconductor price surge in 2026. Texas Instruments has cumulatively adjusted prices five times over the past 12 months. Infineon has completed two price increases this year, with the second round (effective July) seeing AI server power and automotive power devices rise by 10% to 20%. NXP and onsemi have followed suit in the first half of the year. Taiwanese power semiconductor manufacturers are now planning a third round in October, with cumulative increases of 25% to 35% for non‑contract products.
Chinese domestic suppliers are also raising prices in tandem: UNT announced a 15%‑25% price increase for Q3 2026 on June 30. Yangjie Technology raised prices across its entire product portfolio by 10%‑15% effective July 1. And other local players such as NSING and Maxscend have recently issued price‑hike notices. The adjustments now span four key segments: analog chips, power semiconductors, MCUs, and RF front‑end components.
SEMICON IC Components
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● 74LV4053D, 118 (Nexperia): Three-channel SPDT analog switch, 2:1 multiplexing/demultiplexing, 1-6V wide voltage, 16-SOIC package
● STM32F103ZCT6 (ST): ARM Cortex-M3 MCU, 72 MHz main frequency, 256 KB Flash/48 KB RAM, 144-LQFP package
● XC7A12T-2CSG325C (AMD/Xilinx): Artix-7 series FPGA, 12,800 logic units, 150 I/Os, 40 DSP slices, 720 Kb Block RAM, 324-CSBGA package
● C0603X472F5GACAUTO (KEMET): Automotive-grade MLCC ceramic capacitor, 4.7 nF ±1%, 50 V, C0G/NP0 temperature drift, 0603 package
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