Hanmi Semiconductor Invests 130 Billion Won in Eighth Factory
2026-08-19
On August 18, 2026, Hanmi Semiconductor officially announced that it has acquired a 6,230-pyeong plant from Mercury Company located within the Incheon Jeon-an National Industrial Complex, which will be converted into the company's eighth production base. The total investment for the facility amounts to 130 billion won, including 56 billion won for the acquisition, with the remainder allocated to renovation and advanced production infrastructure construction. Mass production is scheduled to commence in the second quarter of 2027.
Product Portfolio
Given the lengthy timeline required to build a new factory from the ground up, Hanmi Semiconductor has adopted a strategy of acquiring an existing facility to significantly shorten the construction period for production infrastructure. This approach enables the company to rapidly respond to surging global demand for AI semiconductor manufacturing equipment.The eighth factory will focus on next-generation semiconductor equipment, including HBM thermocompression (TC) bonders, hybrid bonders, 2.5D packaging equipment for AI semiconductors, as well as BOC and COB equipment for high-performance memory production. Hanmi Semiconductor holds over 90% market share in 12-layer TC bonders for HBM3E and serves as a core supplier to SK Hynix and Micron, backed by a deep technology moat of approximately 120 HBM equipment-related patents. Hybrid bonding technology, which replaces conventional solder bumps with copper-to-copper direct bonding, represents the critical pathway for mass-producing HBM with 20 layers and above.
Hanmi Global Expansion
With the seventh factory—a dedicated hybrid bonder facility with an investment of 100 billion won expected to be completed in the first half of 2027—coming online alongside the eighth factory, Hanmi Semiconductor's total production space will expand to 34,318 pyeong. This will establish the company as the world's largest production base for HBM-TC bonders and hybrid bonders, enabling a qualitative leap in annual production capacity and further cementing its global leadership in AI packaging equipment.
Beyond domestic expansion, Hanmi Semiconductor plans to establish a subsidiary in San Jose, California by the end of 2026 to stay close to North American chip design and manufacturing companies. This move will complete the company's global technical service network, enabling direct collaboration with hyperscale customers such as Microsoft, Google, and AWS, and ensuring timely response to overseas clients' equipment commissioning and process integration needs.
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