Model No: XC3S400AN-4FGG400I
AMD XC3S400AN-4FGG400I
Manufacturer: AMD
SEMICON NO.: XC3S400AN-4FGG400I
Package: 400-FBGA
Stock: In stock
Description: Spartan-3AN FPGA 896 311 I/O
SEMICON NO.: XC3S400AN-4FGG400I
Package: 400-FBGA
Stock: In stock
Description: Spartan-3AN FPGA 896 311 I/O
Quantity :
| Mfr | AMD |
| Product Family | Spartan®-3AN |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements / Cells | 8,064 |
| Logic Array Blocks (LABs/CLBs) | 896 |
| System Gates | 400,000 |
| Total RAM Bits | 368,640 (45 KB) |
| Distributed RAM | 56 kbit |
| Embedded Block RAM | 360 kbit |
| Maximum User I/O Pins | 311 |
| Maximum Operating Frequency | 250 MHz (typical) / 667 MHz (internal) |
| Clock Management | Delay-Locked Loops (DLLs) |
| Core Supply Voltage (VCCINT) | 1.14 V to 1.26 V |
| Operating Temperature | -40°C to +100°C |
| Package | 400-FBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XC3S400AN-4FGG400Inon-volatile FPGA Spartan-3AN FPGA
The XC3S400AN-4FGG400I is a non-volatile FPGA manufactured by AMD Xilinx, belonging to the widely adopted Spartan-3AN family that pioneered the integration of MultiBoot-capable on-chip Flash memory with a low-cost SRAM-based programmable fabric. Built on proven 90 nm process technology, this device delivers 400,000 system gates, 8,064 logic cells organized into 896 configurable logic blocks (CLBs), and 368,640 total RAM bits, all packaged in a compact 400-BGA. It operates from a 1.14 V to 1.26 V core supply, provides up to 311 user I/O pins, and is rated for the industrial temperature range of -40 °C to +100 °C junction temperature, making it a robust solution for harsh-environment embedded designs.
The XC3S400AN-4FGG400I is extensively deployed across industrial automation and control systems, where it manages PLC logic, motor control algorithms, sensor input processing, and actuator coordination with precise timing. In data acquisition and digital signal processing platforms, its combination of logic cells, block RAM, and hardware multipliers facilitates high-speed capture, real-time filtering, and user-reconfigurable algorithm execution without hardware changes. Communication and networking equipment leverage the device for protocol conversion, interface bridging, packet handling, and small-scale switching fabrics. The automotive segment adopts it for infotainment, telematics, GPS, lighting control, and power distribution subsystems, benefiting from its thermal resilience and instant-on behavior. Medical instrumentation—such as portable monitors and diagnostic devices—relies on its reliability and flexibility, while consumer electronics integrate it for display control, TMDS/PPDS interfacing, and high-definition video bridge functions.
Alternative FPGA Models
● XC3S200AN-4FGG400I: A lower-density Spartan-3AN variant offering 200K system gates and fewer logic resources in the same 400-pin FG package, ideal for cost-sensitive industrial designs that do not require the full capacity of the XC3S400AN.
● XC3S700AN-4FGG400I: A higher-capacity sibling providing 700K system gates and expanded block RAM within the identical pin-compatible 400-FBGA footprint, enabling seamless density upgrades for growing logic requirements.
● XC6SLX9-2FTG256C: A modern Spartan-6 low-power alternative offering 9,152 logic cells, advanced DSP slices, and reduced static consumption in a smaller 256-pin package, recommended for new designs requiring improved energy efficiency and migration beyond the Spartan-3AN generation.
The XC3S400AN-4FGG400I is a non-volatile FPGA manufactured by AMD Xilinx, belonging to the widely adopted Spartan-3AN family that pioneered the integration of MultiBoot-capable on-chip Flash memory with a low-cost SRAM-based programmable fabric. Built on proven 90 nm process technology, this device delivers 400,000 system gates, 8,064 logic cells organized into 896 configurable logic blocks (CLBs), and 368,640 total RAM bits, all packaged in a compact 400-BGA. It operates from a 1.14 V to 1.26 V core supply, provides up to 311 user I/O pins, and is rated for the industrial temperature range of -40 °C to +100 °C junction temperature, making it a robust solution for harsh-environment embedded designs.
The XC3S400AN-4FGG400I is extensively deployed across industrial automation and control systems, where it manages PLC logic, motor control algorithms, sensor input processing, and actuator coordination with precise timing. In data acquisition and digital signal processing platforms, its combination of logic cells, block RAM, and hardware multipliers facilitates high-speed capture, real-time filtering, and user-reconfigurable algorithm execution without hardware changes. Communication and networking equipment leverage the device for protocol conversion, interface bridging, packet handling, and small-scale switching fabrics. The automotive segment adopts it for infotainment, telematics, GPS, lighting control, and power distribution subsystems, benefiting from its thermal resilience and instant-on behavior. Medical instrumentation—such as portable monitors and diagnostic devices—relies on its reliability and flexibility, while consumer electronics integrate it for display control, TMDS/PPDS interfacing, and high-definition video bridge functions.
Alternative FPGA Models
● XC3S200AN-4FGG400I: A lower-density Spartan-3AN variant offering 200K system gates and fewer logic resources in the same 400-pin FG package, ideal for cost-sensitive industrial designs that do not require the full capacity of the XC3S400AN.
● XC3S700AN-4FGG400I: A higher-capacity sibling providing 700K system gates and expanded block RAM within the identical pin-compatible 400-FBGA footprint, enabling seamless density upgrades for growing logic requirements.
● XC6SLX9-2FTG256C: A modern Spartan-6 low-power alternative offering 9,152 logic cells, advanced DSP slices, and reduced static consumption in a smaller 256-pin package, recommended for new designs requiring improved energy efficiency and migration beyond the Spartan-3AN generation.
