Adeia Sues AMD for Patent Infringement in Hybrid Bonding

2025-11-04

Recently, Adeia has filed two patent infringement lawsuits in the US District Court for the Western District of Texas, accusing AMD's chips of infringing on its patents related to hybrid bonding technology. Adeia claims that AMD's chips have adopted the patent-innovative technologies covered by its hybrid bonding IP portfolio, involving ten patents. Seven of these patents cover hybrid bonding technology, while three are related to the process nodes used in advanced logic and memory manufacturing. The lawsuits were filed after years of failed licensing negotiations between the two parties and were announced on November 3. AMD has not yet commented on the matter.

The Significance of Hybrid Bonding Technology

Hybrid bonding technology is at the core of AMD's 3D V-Cache design. It has endowed the Ryzen X3D processor with excellent gaming performance and server-level cache density. The technology abandons the traditional solder ball connection method and instead directly fuses copper and dielectric layers between chips to form nearly monolithic connections with micrometer-level spacing. This allows each Zen compute chip to stack 64MB of SRAM without exceeding its thermal or electrical performance limits. It is understood that the technology employs TSMC's SoIC process series, a hybrid bonding technology capable of achieving ultra-high-density 3D integration.

Adeia's Patent Claims

Adeia, which was spun off from Xperi, claims to possess a substantial amount of bonding and interconnect intellectual property. Its DBI and ZiBond technologies have been licensed to major manufacturers in the fields of memory, CMOS image sensors, and 3D NAND. The company now asserts that AMD's products have "widely applied" the same concepts and claims that its patented technologies have "made a significant contribution" to AMD's success.

Technological Competition and Future Outlook

The lawsuit not only involves a patent dispute between AMD and Adeia but also reflects the fierce competition in the hybrid bonding technology field within the semiconductor industry. Hybrid bonding technology has significant advantages in enhancing chip performance and integration density and has become one of the key technologies that various chip manufacturers are competing for. As the technology continues to develop and the market expands, similar patent lawsuits are likely to increase.

The outcome of the lawsuit will have a significant impact on AMD's business. If AMD is found to have infringed on Adeia's patents, it may have to pay a substantial amount of compensation and adjust its chip-manufacturing processes. This will also have a ripple effect on the patent layout and technological development of the entire semiconductor industry. In the future, AMD and Adeia may continue to negotiate over patent issues in search of a settlement solution.

Semicon semiconductor chip distributor

Semicon, a semiconductor chip distributor, is a global electronic component supplier dedicated to providing a wide range of IC chips. Its products cover multiple fields including analog, digital, RF, power management, and interface solutions. Semicon offers a wide range of IC components, including but not limited to analog ics, digital ics, RF ics, interface ics, etc. Here are some of the latest popular IC models from Semicon:

● PIC16F1829-I/SS: A high-performance 8-bit microcontroller suitable for a variety of embedded applications, renowned for its low power consumption and high reliability.

● XC7K410T-2FFG900I: A high-end FPGA with powerful logic processing capabilities and rich I/O interfaces, suitable for data centers and communication equipment.

● ISO7761DW: A highly reliable digital isolator that offers an isolation voltage of up to 5kV to ensure the safety of signal transmission.

● PESD2ETH-AXR: A high-performance Ethernet protection diode that can effectively prevent damage to equipment caused by electrostatic discharge (ESD).

Email: info@semicone.com

Samsung Accelerates 1c DRAM Device Integration, Aims to Mass Produce HBM4 by 2026

MediaTek's ASIC Business: Securing Major Clients and Accelerating AI Chip Layout