Model No: XC7K410T-2FFG900I
AMD XC7K410T-2FFG900I
Manufacturer: AMD
SEMICON NO.: XC7K410T-2FFG900I
Package: 900-FCBGA
Stock: In stock
Description: IC Kintex-7 FPGA 500 900-BBGA、FCBGA
SEMICON NO.: XC7K410T-2FFG900I
Package: 900-FCBGA
Stock: In stock
Description: IC Kintex-7 FPGA 500 900-BBGA、FCBGA
Quantity :
| Mfr | AMD |
| Device Family | Kintex®-7 |
| Logic Cells | 406,720 |
| Configurable Logic Blocks (CLB Slices) | 63,550 (Each slice contains four 6-input LUTs and eight flip-flops) |
| DSP Slices | 1,540 (DSP48E1) |
| Block RAM | 28,620 Kb (approx. 3.58 MB) |
| CMT Clock Management Tiles | 10 (Each contains one MMCM and one PLL) |
| Maximum Transceivers | 16 (12.5 Gb/s GTH Transceivers) |
| PCI Express® | Integrated Block for Gen1/2/3 |
| User I/O Pins | 500 |
| Memory Interface | DDR3: Up to 1866 Mb/s |
| Supply Voltage (Core) | 1.0 V |
| Operating Temperature | -40°C to +100°C |
| Package | 900-FCBGA |
| Mounting Type | Surface Mount (SMD/SMT) |
| Compliance | RoHS Compliant |
XC7K410T-2FFG900I AMD Xilinx FPGA Kintex-7 FPGA
The XC7K410T-2FFG900I is a high-performance Kintex-7 family Field-Programmable Gate Array (FPGA) from Xilinx (now AMD), representing a pinnacle of price-performance optimization within the 28nm technology node. Housed in a 900-ball Flip-Chip Fine-Pitch BGA (FFG900) package, this industrial-temperature grade (-40°C to 100°C) device is engineered for complex, high-speed logic integration. With its robust logic capacity, advanced serial connectivity, and powerful DSP capabilities, it targets demanding applications in aerospace, defense, telecommunications infrastructure, high-end industrial control, and advanced medical imaging systems where processing bandwidth and flexibility are critical.
At the core of the XC7K410T lies a highly optimized architecture built around configurable logic blocks (CLBs) containing look-up tables (LUTs) and flip-flops, providing over 400,000 logic cells for implementing complex digital circuits. The fabric is interconnected by a sophisticated hierarchy of routing resources that ensure high-performance signal integrity and timing closure. This device also includes substantial block RAM (BRAM) resources, offering approximately 28 Mb of distributed on-chip memory for data buffering and storage, which is essential for data-path intensive applications and processor subsystems.
AlternativeFPGA Models
● Intel Stratix V 5SGXEA7K (formerly Altera):A high-end FPGA offering similar logic density and 14.1 Gbps transceivers, competing directly in high-performance computing and communications markets.
● Lattice Semiconductor ECP5-85F:A smaller FPGA focused on cost-sensitive, low-power applications like video bridging and network acceleration, offering a compelling alternative where ultimate performance is not required.
V Microchip PolarFire PF500T:A mid-range FPGA known for its exceptionally low static power consumption and defense-grade security features, ideal for power-constrained and secure communications systems.
● Achronix Speedster22i HD1000:A high-performance FPGA alternative emphasizing very high-speed data path processing with embedded network-on-chip (NoC) for deterministic internal connectivity.