Model No: ISM330DHCXTR
STMicroelectronics ISM330DHCXTR
Manufacturer: STMicroelectronics
SEMICON NO.: ISM330DHCXTR
Package: 14-LGA
Stock: In stock
Description: iNEMO Inertial Module, 6-axis sensor I2C, SPI output
SEMICON NO.: ISM330DHCXTR
Package: 14-LGA
Stock: In stock
Description: iNEMO Inertial Module, 6-axis sensor I2C, SPI output
Quantity :
| Mfr | STMicroelectronics |
| Type | 6-axis inertial measurement unit (IMU) – Accelerometer + Gyroscope |
| Accelerometer Range | ±2g, ±4g, ±8g, ±16g (programmable) |
| Gyroscope Range | ±125dps, ±250dps, ±500dps, ±1000dps, ±2000dps, ±4000dps (programmable) |
| Output Data Rate (ODR) | Accelerometer/Gyroscope: Up to 6.66 kHz |
| Interface | I²C, SPI (4-wire, 3-wire) |
| Supply Voltage (Vdd) | 1.71V to 3.6V |
| Current Consumption | Low-power mode: 0.4mA (accelerometer only) High-performance mode: 1.2mA (IMU) |
| FIFO Buffer | 9kB (for data batching) |
| Embedded Features | - Machine Learning Core (MLC) - Finite State Machine (FSM) - Pedometer - Tilt detection - Free-fall detection |
| Shock Resistance | 10,000g (accelerometer), 1,000g (gyroscope) |
| Other Key Features | - Embedded temperature sensor - Analog supply noise filtering - Auto-calibration |
| Operating Temperature | -40°C to +85°C |
| Package/Sizes | 14-LGA |
STM Sensor ISM330DHCXTR Accelerometer Gyroscope Combo, 3D Accelerometer, 3D Gyroscope
The ISM330DHCXTR is a highly integrated, ultra-low-power 3D digital accelerometer and 3D digital gyroscope module, specifically designed for a wide range of applications demanding high performance and compact size. Manufactured by STMicroelectronics, this chip combines two core motion sensors onto a single silicon die, enabling precise measurement of both linear acceleration (up to ±8g) and angular rate (up to ±2000°/s). Encapsulated in a compact LGA package, it is ideal for use in wearable devices, smartphones, tablets, drones, virtual reality systems, and industrial sensors where space is at a premium and power consumption needs to be minimized.
Key Features and Performance
Boasting exceptional performance, the ISM330DHCXTR offers high resolution and accuracy across its entire measurement ranges. The accelerometer provides selectable full-scale ranges of ±2g, ±4g, ±8g, and ±16g, while the gyroscope offers ±125°/s, ±250°/s, ±500°/s, ±1000°/s, and ±2000°/s options, allowing for optimal sensitivity and dynamic range tuning for specific application needs. Both sensors feature integrated digital low-pass filters (LPFs) with configurable bandwidths to effectively reduce noise and eliminate unwanted high-frequency signals. The device operates with a very low current consumption, typically below 1mA in normal mode for both sensors combined, and supports various low-power modes to further extend battery life in portable devices. Its high shock survival capability ensures reliability even in demanding environments.
Applications and Benefits
This highly integrated inertial module finds extensive applications in consumer electronics, such as enabling gesture recognition, screen auto-rotation, and motion-based gaming in smartphones and tablets. In wearables, it powers activity tracking, step counting, and fall detection features. For drones and robotics, it provides essential stabilization and orientation data. Its benefits include reduced system complexity by integrating two sensors into one package, saving valuable PCB space. The low power consumption is critical for extending battery life in portable and wearable devices.
Alternative IMU SensorModels
The ICM-42688-P offers a higher performance gyroscope (up to ±4000°/s), integrated machine learning capabilities, and a smaller footprint, ideal for advanced motion processing and AI applications.
The BNO085, a system-in-package (SiP) that integrates a 3D accelerometer, 3D gyroscope, 3D magnetometer, and a powerful processing core, providing absolute orientation ( quaternion output) and complex sensor fusion algorithms out-of-the-box, simplifying development for complex orientation-based applications.
The ICM-42688-P offers a higher performance gyroscope (up to ±4000°/s), integrated machine learning capabilities, and a smaller footprint, ideal for advanced motion processing and AI applications.
The BNO085, a system-in-package (SiP) that integrates a 3D accelerometer, 3D gyroscope, 3D magnetometer, and a powerful processing core, providing absolute orientation ( quaternion output) and complex sensor fusion algorithms out-of-the-box, simplifying development for complex orientation-based applications.
