Model No: FDP083N15A-F102

onsemi FDP083N15A-F102

Manufacturer: onsemi
SEMICON NO.: FDP083N15A-F102
Package: TO-220-3
Stock: In stock
Description: N channel 150 V 83 A 294W
Quantity :
Contact Now
 
 Mfr   onsemi 
 Device Type N-Channel Enhancement Mode Power MOSFET    
 Drain-Source Voltage   150 V    
 Continuous Drain Current  117 A
 Pulsed Drain Current   468 A    
 Power Dissipation   294 W    
 Gate-Source Voltage  ±20 V 
 Drain-Source On-Resistance(Max) 8.3 mΩ
 Drain-Source On-Resistance (Typ) 6.85 mΩ
 Gate Threshold Voltage (Max)   4.0 V 
 Total Gate Charge (Typ) 64.5 nC
 Total Gate Charge (Max)   84 nC
 Input Capacitance (Typ)  4645 pF  
 Input Capacitance (Max) 6040 pF
 Output Capacitance (Typ)  1445 pF
 Reverse Transfer Capacitance (Typ)     100 pF
 Operating Temperature -55°C to +175°C
 Package TO-220-3
 Mounting Type Through Hole
 Compliance    
 RoHS Compliant
FDP083N15A-F102 N-channel power MOSFET
The FDP083N15A-F102 from onsemi is a 150V N-channel PowerTrench power MOSFET optimized for very low on-resistance and robust high-current switching in server, telecom and industrial power conversion. It is rated for 150V VDS and up to 117A continuous drain current at 25°C case temperature, with a maximum RDS(on) of 8.3mΩ at VGS=10V, ID=75A and a typical RDS(on) of 6.85mΩ under the same conditions, which minimizes conduction losses in high-current synchronous rectification and OR-ing applications. The device achieves this through onsemi’s PowerTrench trench-gate technology, which reduces cell pitch and optimizes the vertical current path to simultaneously lower RDS(on) and gate charge, while maintaining a safe operating area and high avalanche energy capability.
Dynamic performance is supported by a typical gate charge of 64.5nC at VGS=10V and an input capacitance around 4.6nF, enabling fast switching transitions and moderate driving loss in medium-frequency hard-switched and soft-switched converters. The MOSFET is housed in a through-hole TO-220-3 package with a maximum power dissipation of 294W at Tc=25°C and a junction temperature range of -55°C to 175°C, making it suitable for high-density boards that require heatsinking and reliable operation under severe thermal cycling. Typical applications include ATX/server/telecom PSU synchronous rectification, battery protection, motor drives, UPS and micro-inverters, where low RDS(on) and high current handling directly improve efficiency and power density.
Alternative MOSFETs
● IRFB4321PBF: A 150V, 85A N-channel HEXFET power MOSFET from Infineon with 15mΩ max RDS(on) and 71nC typical gate charge in TO-220AB, offering robust high-current switching for motor drives and inverters where a slightly higher RDS(on) is acceptable.
● IPB083N10N3G: An Infineon OptiMOS 3 100V, 80A N-channel MOSFET in TO-263-3 with 8.3mΩ max RDS(on) and 55nC gate charge, optimized for high-efficiency synchronous rectification and DC-DC converters in telecom and datacom systems.
● STP80NF70: An STMicroelectronics STripFET II 68V, 98A N-channel MOSFET in TO-220 with 9.8mΩ max RDS(on) and 75nC gate charge, tailored for high-efficiency switching in 48V battery and industrial power applications.