Fujifilm Expands Chip Material Production Capacity

2026-08-25

In August 2026, Fujifilm announced that a new production building at its semiconductor materials plant in Oita Prefecture, Kyushu, Japan, has been completed and commenced operations.

Fujifilm Expands Chip Material Production Capacity

The expansion project represents a total investment of approximately 7 billion yen (about $44 million). The new facility covers a floor area of roughly 3,600 square meters with a four-story steel-frame structure. Operated by FUJIFILM Electronic Materials Co., Ltd., the plant focuses on manufacturing post-CMP cleaners. Upon ramp-up, the Oita facility's capacity for this product category will triple compared to previous levels. The new building is equipped with automated manufacturing systems and quality assessment equipment meeting the ultra-high purity requirements of cutting-edge semiconductors. Additionally, solar panels installed on the roof expand the use of renewable energy, balancing capacity expansion with low-carbon operations.

Post-CMP cleaners are core consumables following the CMP process, responsible for removing particles, trace metals, and organic residues from the wafer surface while protecting metal surfaces from damage. As semiconductor processes advance toward nodes below 2nm and 3D stacking technologies see wider adoption, the number of CMP steps has increased significantly. The performance of post-cleaning solutions has become one of the key variables affecting chip manufacturing yield. Fujifilm projects that sales revenue for this product category will more than double by fiscal year 2030 compared to fiscal year 2024.

Semiconductor Materials: A Growth Engine

Semiconductor materials have been positioned by Fujifilm as the strategic business segment with the highest growth potential within the group. The Oita expansion is also a major component of the approximately 20 billion yen comprehensive investment plan announced by Fujifilm in September 2024. This plan covers two key sites: Shizuoka and Oita. The Yoshida-cho plant in Shizuoka focuses on research and development of cutting-edge products such as photoresists required for processes below 2 nanometers, with its new R&D building inaugurated in November 2025. The Oita plant, meanwhile, concentrates on expanding production capacity for post-CMP cleaners and slurries, as well as photosensitive insulating films such as polyimide. The company aims to increase semiconductor material sales from 245 billion yen in fiscal year 2025 to 500 billion yen by fiscal year 2031.

Domestically in Japan, Rapidus plans to mass-produce 2-nanometer-class leading-edge chips by 2027, and Fujifilm is actively providing supporting materials for its development efforts. From imaging giant to core supplier of semiconductor materials, Fujifilm's transformation is accelerating alongside the expansion of computing power in the AI era.

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