Model No: W25Q256JVEIQ
Winbond Electronics W25Q256JVEIQ
Manufacturer: Winbond Electronics
SEMICON NO.: W25Q256JVEIQ
Package: 8-WSON
Stock: In stock
Description: NOR FLASH Memory 256Mbit 133MHz
SEMICON NO.: W25Q256JVEIQ
Package: 8-WSON
Stock: In stock
Description: NOR FLASH Memory 256Mbit 133MHz
Quantity :
| Mfr | Winbond Electronics |
| Product Family | SpiFlash |
| Device Type | Serial NOR Flash Memory |
| Memory Size / Density | 256 Mbit (32 MByte) |
| Memory Organization | 32M x 8 |
| Technology | FLASH - NOR |
| Interface Type | SPI - Quad I/O |
| Max Clock Frequency | 133 MHz |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Standby Current (Typ) | 10 µA |
| Supply Current (Read) | 25 mA (Max) |
| Operating Temperature | -40°C to +85°C |
| Package | 8-WSON |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
W25Q256JVEIQ 256-megabit SPI Flash memory
The W25Q256JVEIQ is a high-performance, 256-megabit (32-megabyte) Serial Peripheral Interface (SPI) Flash memory device manufactured by Winbond Electronics, designed to provide high-density storage for embedded systems. Housed in a compact 8-pin WSON package, indicated by the"IQ"suffix, this device is engineered for applications requiring minimal board space while demanding substantial memory capacity. It operates on a standard voltage range of 2.7V to 3.6V and supports standard SPI, Dual Output SPI, and Quad Output SPI modes, allowing for flexible interface design. The chip is an essential component in modern electronics design, bridging the gap between the need for extensive data logging or code storage and the physical constraints of space-constrained printed circuit board layouts.
This Flash memory IC distinguishes itself through its advanced Quad SPI (QPI) capability, which significantly enhances data transfer rates and execution efficiency for system processors. It supports a high-speed clock frequency of up to 133 MHz for read operations, effectively reducing system boot times and accelerating code execution via Execute-in-Place (XIP) functionality. The device integrates robust security features, including a 512-byte Security Register with Unique ID and Factory Lock-down options, ensuring the integrity of sensitive boot code. Furthermore, it offers advanced power management with a deep power-down mode that reduces current consumption to microamp levels, which is crucial for battery-powered designs.
Alternative SPI Flash IC Models
● Micron MT25QL256: This device offers a compatible 256Mb Quad SPI interface and high endurance, specifically engineered for demanding automotive and industrial temperature ranges.
● Macronix MX25L256: This alternative provides a robust 256Mb density with high-speed read capabilities, serving as a pin-to-pin compatible solution for general embedded applications.
● ISSI IS25LP256: This model features a wide voltage range and fast data transfer rates, making it an excellent substitute for low-power and battery-operated system designs.
● GigaDevice GD25Q256: This flash memory delivers high-performance Quad SPI throughput and deep power-down features, offering a cost-effective and reliable cross-platform alternative.
The W25Q256JVEIQ is a high-performance, 256-megabit (32-megabyte) Serial Peripheral Interface (SPI) Flash memory device manufactured by Winbond Electronics, designed to provide high-density storage for embedded systems. Housed in a compact 8-pin WSON package, indicated by the"IQ"suffix, this device is engineered for applications requiring minimal board space while demanding substantial memory capacity. It operates on a standard voltage range of 2.7V to 3.6V and supports standard SPI, Dual Output SPI, and Quad Output SPI modes, allowing for flexible interface design. The chip is an essential component in modern electronics design, bridging the gap between the need for extensive data logging or code storage and the physical constraints of space-constrained printed circuit board layouts.
This Flash memory IC distinguishes itself through its advanced Quad SPI (QPI) capability, which significantly enhances data transfer rates and execution efficiency for system processors. It supports a high-speed clock frequency of up to 133 MHz for read operations, effectively reducing system boot times and accelerating code execution via Execute-in-Place (XIP) functionality. The device integrates robust security features, including a 512-byte Security Register with Unique ID and Factory Lock-down options, ensuring the integrity of sensitive boot code. Furthermore, it offers advanced power management with a deep power-down mode that reduces current consumption to microamp levels, which is crucial for battery-powered designs.
Alternative SPI Flash IC Models
● Micron MT25QL256: This device offers a compatible 256Mb Quad SPI interface and high endurance, specifically engineered for demanding automotive and industrial temperature ranges.
● Macronix MX25L256: This alternative provides a robust 256Mb density with high-speed read capabilities, serving as a pin-to-pin compatible solution for general embedded applications.
● ISSI IS25LP256: This model features a wide voltage range and fast data transfer rates, making it an excellent substitute for low-power and battery-operated system designs.
● GigaDevice GD25Q256: This flash memory delivers high-performance Quad SPI throughput and deep power-down features, offering a cost-effective and reliable cross-platform alternative.
