Model No: NTJD4152PT1G

onsemi NTJD4152PT1G

Manufacturer: onsemi
SEMICON NO.: NTJD4152PT1G
Package: SC-88/SC70-6/SOT-363
Stock: In stock
Description: MOSFET Array 20V 880mA 272mW
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 Mfr       onsemi 
 Device Type  Dual P-Channel Small Signal MOSFET
 Technology     Trench MOSFET
 Drain-Source Voltage    -20 V
 Gate-Source Voltage   ±12 V
 Continuous Drain Current      -0.88 A @ 25°C
 Pulsed Drain Current     -2.2 A
 Power Dissipation      272 mW @ 25°C
 Power Dissipation (Alt)   280 mW
 Drain-Source On-Resistance   260 mΩ (Max) / 215 mΩ (Typ)
 Gate Threshold Voltage   -1.2 V (Max) @ 250µA
 Gate Charge      2.2 nC (Max) / 1.3 nC 
 Input Capacitance     155 pF (Max)
 Output Capacitance     6 pF
 Operating Temperature  -55°C to +150°C
 Package SC-88/SC70-6/SOT-363
 Mounting Type Surface Mount
 Compliance    
 RoHS Compliant
 
The NTJD4152PT1G is a dual P-channel trench small-signal MOSFET manufactured by onsemi, featuring a drain-source voltage rating of -20V with a continuous drain current of -0.88A per channel in a compact SC-88 (SOT-363/SC70-6 equivalent) 6-pin surface-mount package. This device incorporates leading trench technology that delivers low RDS(ON) performance of 0.215Ω maximum at VGS = -4.5V, combined with integrated ESD protection on the gate structures for enhanced reliability in demanding applications. The MOSFET operates with logic-level gate drive compatibility, supporting gate-source voltages up to ±12V with a gate threshold voltage range of -0.45V to -1.2V, enabling direct interface with modern low-voltage microcontrollers and battery-powered circuits. 
Feature Highlights
● Dual P-Channel Configuration: Integrates two independent P-channel MOSFETs in a single SC-88 package, enabling compact implementation of complementary switching circuits, bridge configurations, and dual-channel load switches while reducing component count and board space requirements.
● Leading Trench Technology: Advanced trench construction achieves RDS(ON) of 0.215Ω maximum at VGS = -4.5V, minimizing conduction losses and improving efficiency in power switching applications compared to planar MOSFET alternatives.
● ESD Protected Gate: Integrated electrostatic discharge protection on gate structures provides robust handling reliability during assembly and operation, reducing sensitivity to ESD events that could damage conventional unprotected MOSFETs.
● Logic-Level Gate Drive: Gate threshold voltage range of -0.45V to -1.2V enables direct drive from 2.5V and 3.3V logic circuits without requiring level-shifting circuitry or charge pumps, simplifying design in battery-powered applications.
● Low Gate Charge: Total gate charge of only 2.2nC at VGS = 4.5V enables fast switching speeds with minimal drive power requirements, reducing switching losses and supporting high-frequency PWM operation in power management circuits.
FAQ
Q: What is the key advantage of the dual P-channel configuration in a single package?
A:The dual-channel integration enables implementation of bridge circuits, complementary switching topologies, and dual load switches in minimal board space, reducing component count by approximately 50% compared to discrete single-channel solutions while ensuring matched thermal characteristics between channels.
Alternative MOSFET array Models
● SI1913EDH: This dual P-channel 20V TrenchFET MOSFET offers equivalent electrical specifications in the same SOT-363 package with halogen-free construction, providing a direct cross-platform alternative for space-constrained power management applications.
● SI6913DN: This dual P-channel MOSFET delivers higher current capability with 4.9A continuous rating and lower RDS(ON) of 16mΩ in compact packaging, suitable for more demanding load switching applications requiring increased power handling.
● NTHD4102PT1G: This dual P-channel device provides higher current capability of -2.9A with the same -20V voltage rating in similar packaging, offering enhanced power handling for applications exceeding the NTJD4152P current limits.