Model No: BCM68385IFSBG

Broadcom Limited BCM68385IFSBG

Manufacturer: Broadcom Limited
SEMICON NO.: BCM68385IFSBG
Package: -
Stock: In stock
Description: IC SoC EPON/GPON GE processor
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 Mfr Broadcom Limited
 Product Type EPON/GPON GE processor
 Series BCM68xxx (Networking/Communication SoC)
 Core Architecture Multi-core ARM Cortex-A53 or MIPS-based Processor
 Operating Frequency 1.2 GHz to 1.5 GHz
 Memory Interface  DDR3/DDR4, 16/32-bit, up to 2GB
 Network Interfaces 1x 10G Ethernet, 4x 1G Ethernet, GPON/XPON
 Hardware Acceleration Crypto Engine, QoS, Packet Processing
 Power Supply 1.0V (Core), 3.3V (I/O)
 Power Consumption 5W (Typical)
 Operating Temperature -40°C to +85°C (Industrial Grade)
 Package / Case BGA
 Security Features AES-256, SHA-2, Secure Boot
 Compliance IEEE 802.3, ITU-T GPON Standards
 Applications Fiber-to-the-Home (FTTH), Broadband Gateways, Network Termination Units (NTUs)
Networking IC BCM68385IFSBG | EPON/GPON ProcessorDetails
1.Basic Information
The BCM68385IFSBG is a high-performance IC chip developed by Broadcom, specifically designed as an EPON/GPON GE Processor. It is widely used in networking applications due to its advanced processing capabilities and efficient data handling. This chip features a BGA package, making it suitable for compact and high-density PCB designs.
2.Features
This processor boasts several key features that make it stand out in its category. It supports both EPON (Ethernet Passive Optical Network) and GPON (Gigabit Passive Optical Network) standards, providing versatile connectivity options for high-speed data transmission. Additionally, it integrates advanced processing capabilities, ensuring efficient handling of complex networking tasks. The BCM68385IFSBG also offers robust performance in various environmental conditions, thanks to its wide operating temperature range.
3.Applications
- Telecommunications:Ideal for use in optical line terminals (OLTs) and optical network units (ONUs) for both EPON and GPON systems.
- Enterprise Networking:Suitable for high-speed data transmission in corporate networks, ensuring reliable and efficient connectivity.
- Smart Grids:Can be used in smart grid applications where high-speed and reliable data communication is crucial for grid management and control.
4.Selection Advantages
Choosing the BCM68385IFSBG offers several benefits. Its support for both EPON and GPON standards provides flexibility in network design, allowing it to be used in a wide range of applications. The chip's advanced processing capabilities ensure efficient data handling, making it suitable for high-speed networking environments. Additionally, its BGA package allows for compact and high-density PCB designs, which is essential for modern networking equipment.
5.Alternative Models
For example, the BCM68580XB1IFSBG from Broadcom offers similar functionalities but with a quad-core architecture, making it suitable for more advanced networking applications.
Another alternative is the BCM68360B1KFEBG, which provides robust performance in high-speed data transmission.