Model No: XC7A35T-1FTG256C
AMD XC7A35T-1FTG256C
Manufacturer: AMD
SEMICON NO.: XC7A35T-1FTG256C
Package: 256-FTBGA
Stock: In stock
Description: IC FPGA 170 464 MHz 3.3 V
SEMICON NO.: XC7A35T-1FTG256C
Package: 256-FTBGA
Stock: In stock
Description: IC FPGA 170 464 MHz 3.3 V
Quantity :
| Mfr | AMD |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements / Cells | 33,280 |
| Logic Array Blocks (LABs/CLBs) | 2,600 |
| Total RAM Bits | 1,843,200 bits (1.8 Mbit) |
| Maximum User I/O Pins | 170 |
| Maximum Clock Frequency | 464 MHz |
| I/O Supply Voltage | 3.3 V |
| Clock Management | MMCM and PLL |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Operating Temperature | 0°C to +85°C |
| Package | 256-FTBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XC7A35T‑1FTG256C is a commercial‑grade Artix‑7 FPGA developed by AMD Xilinx, manufactured on a 28nm high‑performance low‑power HKMG process with 33280 logic cells, 90 DSP48E1 slices, and 1800 Kb of embedded block RAM. Packaged in a compact 256‑ball fine‑pitch FTBGA housing, this ‑1 speed‑grade device runs within 0 °C‑85 °C commercial temperature range, supports rich high‑speed I/O interfaces, built‑in PLL and MMCM clock management modules, and AES bitstream encryption, delivering an optimal balance of low power consumption, programmable flexibility and affordable cost for mid‑range embedded digital systems, and it is fully compatible with the Vivado design suite for fast hardware development and firmware upgrade.
Applications
XC7A35T‑1FTG256C is widely deployed for industrial automation control hardware, real‑time image and video pre‑processing modules, high‑speed data acquisition boards, custom protocol conversion bridges, software‑defined radio equipment, drone control units, laboratory test‑and‑measurement instruments, university FPGA education platforms and cost‑sensitive communication interface systems requiring low‑latency programmable logic functions.
FAQ
Q: What is the difference between XC7A35T‑1FTG256C and XC7A35T‑1FTG256I?
A: The suffix C stands for commercial 0‑85°C temperature grade, while I means industrial ‑40‑100°C rating for harsher environments.
Q: What precautions are required for BGA PCB layout?
A: Perform sufficient power‑supply decoupling, complete impedance matching for high‑speed differential traces, and reserve thermal vias under the BGA pad for heat dissipation.
Alternative FPGA Models
● XC7A35T‑1FTG256I: Industrial‑temperature variant with identical logic resources and pin‑to‑pin compatibility, designed for outdoor and harsh industrial operating environments.
● XC7A50T‑2FTG256C: Higher‑density Artix‑7 FPGA with increased logic, DSP and memory resources, suitable when larger‑scale programmable capacity is required.
● XC7A25T‑1FTG256C: Lower‑cost Artix‑7 device with reduced logic cell count, an economical downgrade option for less complex FPGA projects.
Applications
XC7A35T‑1FTG256C is widely deployed for industrial automation control hardware, real‑time image and video pre‑processing modules, high‑speed data acquisition boards, custom protocol conversion bridges, software‑defined radio equipment, drone control units, laboratory test‑and‑measurement instruments, university FPGA education platforms and cost‑sensitive communication interface systems requiring low‑latency programmable logic functions.
FAQ
Q: What is the difference between XC7A35T‑1FTG256C and XC7A35T‑1FTG256I?
A: The suffix C stands for commercial 0‑85°C temperature grade, while I means industrial ‑40‑100°C rating for harsher environments.
Q: What precautions are required for BGA PCB layout?
A: Perform sufficient power‑supply decoupling, complete impedance matching for high‑speed differential traces, and reserve thermal vias under the BGA pad for heat dissipation.
Alternative FPGA Models
● XC7A35T‑1FTG256I: Industrial‑temperature variant with identical logic resources and pin‑to‑pin compatibility, designed for outdoor and harsh industrial operating environments.
● XC7A50T‑2FTG256C: Higher‑density Artix‑7 FPGA with increased logic, DSP and memory resources, suitable when larger‑scale programmable capacity is required.
● XC7A25T‑1FTG256C: Lower‑cost Artix‑7 device with reduced logic cell count, an economical downgrade option for less complex FPGA projects.
