Model No: XC7A200T-2FBG484I
AMD XC7A200T-2FBG484I
Manufacturer: AMD
SEMICON NO.: XC7A200T-2FBG484I
Package: 484-BBGA, FCBGA
Stock: In stock
Description: Artix-7 FPGA IC 285 13455360 215360
SEMICON NO.: XC7A200T-2FBG484I
Package: 484-BBGA, FCBGA
Stock: In stock
Description: Artix-7 FPGA IC 285 13455360 215360
Quantity :
| Mfr | AMD |
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Artix®-7 |
| Logic Elements / Cells | 215,360 |
| Logic Array Blocks (LABs/CLBs) | 16,825 |
| Slices | 33,650 |
| CLB Flip-Flops | 269,200 |
| Total RAM Bits | 13,455,360 bits |
| Total Block RAM | 13,140 Kbit |
| Maximum Distributed RAM | 2,888 Kbit |
| Maximum User I/O Pins | 285 |
| Maximum Operating Frequency | 628 MHz |
| I/O Supply Voltage | 3.3 V |
| Number of GTP Transceivers | 4 |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Operating Temperature | -40°C to +100°C |
| Package | 484-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XC7A200T‑2FBG484I is an industrial‑grade mid‑range FPGA from AMD Xilinx Artix‑7 family, fabricated on 28nm HKMG low‑power process and housed in 484‑ball FCBGA package with 285 user I/O channels, delivering 215360 logic cells, 740 DSP48E1 slices, abundant block RAM resources and 16 integrated 6.6Gbps GTP serial transceivers, supporting PCIe Gen2, DDR3 high‑speed memory and multiple differential I/O standards for cost‑optimized industrial embedded designs with industrial temperature range from ‑40℃ to 100℃.
Key Features
● Rich DSP slices supporting massive parallel arithmetic computation for signal processing workflows
● 13140Kb total block RAM plus configurable distributed RAM for flexible on‑chip buffering; sixteen GTP transceivers supporting high‑speed serial links for optical communication and high‑bandwidth data transmission
● Integrated XADC analog monitoring module for on‑chip voltage and temperature real‑time detection; multi‑mode configuration interfaces including JTAG and SPI flash boot
● Flexible I/O banks compatible with LVCMOS, SSTL, HSTL and LVDS differential signaling
● Rich DSP slices supporting massive parallel arithmetic computation for signal processing workflows
● 13140Kb total block RAM plus configurable distributed RAM for flexible on‑chip buffering; sixteen GTP transceivers supporting high‑speed serial links for optical communication and high‑bandwidth data transmission
● Integrated XADC analog monitoring module for on‑chip voltage and temperature real‑time detection; multi‑mode configuration interfaces including JTAG and SPI flash boot
● Flexible I/O banks compatible with LVCMOS, SSTL, HSTL and LVDS differential signaling
Common questions
Q: Can XC7A200T‑2FBG484I work without external memory?
A: It can run purely on internal BRAM resources, yet external DDR3 is required for large‑volume data buffering.
Q: Is it pin‑compatible with other Artix‑7 chips?
A: Partial family members share package footprint, but power and special function pins need careful PCB verification before replacement.
Q: Can XC7A200T‑2FBG484I work without external memory?
A: It can run purely on internal BRAM resources, yet external DDR3 is required for large‑volume data buffering.
Q: Is it pin‑compatible with other Artix‑7 chips?
A: Partial family members share package footprint, but power and special function pins need careful PCB verification before replacement.
Alternative FPGA models
1. XC7A200T‑3FBG484I: Pin‑compatible Artix‑7 FPGA with higher‑performance‑3 speed grade for timing‑tight high‑frequency industrial projects.
2. XC7A100T‑2FBG484I: Pin‑compatible lower‑resource Artix‑7 variant suitable for cost‑down redesign when logic and DSP resource consumption is moderate.
3. XC7A200T‑2FBG676I: Higher‑pin‑count 676‑ball package version offering expanded user I/O quantity for multi‑interface complex system development.
1. XC7A200T‑3FBG484I: Pin‑compatible Artix‑7 FPGA with higher‑performance‑3 speed grade for timing‑tight high‑frequency industrial projects.
2. XC7A100T‑2FBG484I: Pin‑compatible lower‑resource Artix‑7 variant suitable for cost‑down redesign when logic and DSP resource consumption is moderate.
3. XC7A200T‑2FBG676I: Higher‑pin‑count 676‑ball package version offering expanded user I/O quantity for multi‑interface complex system development.
