NVIDIA's Self-Developed HBM Base Die: nm Process and 2027 Trial Production
2025-08-18
Recently, NVIDIA has been reported to be entering the HBM (High Bandwidth Memory) Base Die market, a move that has garnered significant attention within the industry. It is understood that NVIDIA has initiated the design plan for its own HBM Base Die. In the future, regardless of which memory brand's HBM stack product it is paired with, the underlying logic die (Base Die) will adopt NVIDIA's proprietary design solution, with the process node locked at 3nm. NVIDIA is expected to begin trial production in small quantities in the second half of 2027.
The importance of HBM technology in the fields of high-performance computing and artificial intelligence is becoming increasingly prominent. The market is predominantly led by major DRAM manufacturers, among which SK Hynix holds the highest market share. However, as the requirement for HBM transfer speeds increases to over 10Gbps, the process complexity also rises, necessitating the use of advanced process technologies from foundries like TSMC. For example, HBM4 and above require transfer rates of over 10G, necessitating the creation of a Logic die using advanced processes, which is thus entrusted to TSMC.
NVIDIA's Motivation and Strategy
NVIDIA's move aims to enhance the smoothness of data transfer between HBM and GPUs, CPUs, offer customers more modular choices, and further strengthen its control over the NVLink Fusion open architecture ecosystem. By developing its own HBM Base Die, NVIDIA hopes to provide more efficient solutions in the fields of high-performance computing and artificial intelligence, meeting the market's demand for high-speed data transfer and high integration.
Industry Impact and Competitive Landscape
NVIDIA's entry is seen as a challenge to the ASIC market, but the likelihood of its solutions being adopted by CSP (Cloud Service Provider) giants is relatively low. Industry analysis suggests that CSP giants invest in ASICs precisely to avoid dependence on NVIDIA, hence their limited acceptance of NVIDIA's HBM Base Die. However, NVIDIA's modular design is expected to benefit partners such as MediaTek and WorldCore, bringing more business opportunities.
Meanwhile, SK Hynix, a leader in HBM technology, is also accelerating the mass production of HBM4. SK Hynix earlier announced that it had provided samples of the new generation 12-layer stacked HBM4 to major customers. Combined with advanced MR-MUF packaging technology, the capacity can reach 36GB, and the bandwidth exceeds 2TB per second, an increase of over 60% compared to the previous generation HBM3E.
Future Outlook
With NVIDIA's plan to self-manufacture Base Dies and SK Hynix's accelerated mass production of HBM4, the HBM market is set to witness a new wave of competition and transformation. The HBM4 era will move towards higher speeds, higher stacking, and more complex packaging integration. In the future, the development of HBM technology will not only depend on the production capacity and technological innovation of memory manufacturers but will also be influenced by chip design companies and packaging and testing vendors.
NVIDIA's strategic layout not only reflects its ambition in the fields of high-performance computing and artificial intelligence but also signals that future competition in the HBM market will become more intense. Various manufacturers will engage in comprehensive competition in technological innovation, cost control, and market expansion to vie for market share in this critical area.
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