2nm Node Yield: Latest Developments from TSMC, Intel, and Samsung
2025-07-16
In the semiconductor industry, the 2nm node has become a focal point of competition among major manufacturers. Yield, a key metric for measuring chip manufacturing efficiency and cost, directly determines a manufacturer's competitiveness in the market. According to the latest report from KeyBanc Capital Markets analyst John Vinh, there are significant differences in the yield performance of TSMC, Intel, and Samsung Electronics at the 2nm node.
Current Yield Status for Each Manufacturer's 2nm Node
TSMC's yield at the 2nm node is currently around 65%, with an expected increase to
75% once the technology matures. The N2 process employs a Gate-All-Around Field-Effect Transistor (GAAFET) architecture, combined with innovative materials and lithography techniques, representing a 12% improvement over the 3nm node. This yield level enables TSMC to mass-produce flagship chips for clients such as Apple and Nvidia in 2025.
75% once the technology matures. The N2 process employs a Gate-All-Around Field-Effect Transistor (GAAFET) architecture, combined with innovative materials and lithography techniques, representing a 12% improvement over the 3nm node. This yield level enables TSMC to mass-produce flagship chips for clients such as Apple and Nvidia in 2025.Intel's yield for the 18A process has risen from 50% in the previous quarter to 55%, and is expected to further increase to 65% - 70% by the fourth quarter of 2025. Utilizing RibbonFET transistor technology, this process supports Intel's goal of launching the Panther Lake processor in 2025. Additionally, Intel plans to begin mass production of the enhanced 18A-P process in the second half of 2026, which, if it reaches the anticipated yield, will significantly boost its competitiveness in the data center CPU market.
- Samsung's SF2 Process
Samsung Electronics' yield for the 2nm node (SF2) is currently around 40%, lagging behind the other two major manufacturers. The SF2 process uses a Multi-Bridge Channel Field-Effect Transistor (MBCFET) structure but faces yield bottlenecks. Although Samsung plans to introduce EUV double-patterning technology in the fourth quarter of 2025 to raise the yield to 50%, it still has a considerable gap compared to TSMC and Intel.
Impact of Yield Differences on Market Competition
- Technical and Market Advantages
TSMC continues to solidify its leading position in the high-end chip market with its higher yield and mature technology. The high yield of its N2 process allows it to achieve mass production earlier, meeting the demand for high-performance chips from customers and further expanding its market share.
By continuously improving the yield of its 18A process, Intel is expected to achieve mass production by the end of 2025 and compete with TSMC using the 18A-P process in 2026. Although its yield is still lower than TSMC's, Intel's rapid catch-up and the expansion of its foundry business will bring new growth opportunities.
Samsung needs to upgrade its technology to improve the yield of the SF2 process within 2025 to close the gap with its competitors. Otherwise, its market share in the 2nm segment may be further squeezed.
- Future Outlook
- TSMC: Plans to introduce the enhanced N2P process in 2026, supporting backside power delivery technology, with a target yield of 80%. This will further consolidate its position in the high-end mobile SoC market and give it an edge in the AI chip and high-performance computing markets.
- Intel: If the 18A-P process is successfully mass-produced in the second half of 2026 and reaches the expected yield, Intel is expected to capture a larger share of the data center CPU market. Additionally, Intel plans to gradually transition to the 14A process in 2027 to further enhance its competitiveness in the high-end chip market.
- Samsung: After introducing EUV double-patterning technology in the fourth quarter of 2025, Samsung's target yield for the SF2+ process is 50%, focusing on breaking into the automotive chip market. However, its overall competitiveness in the 2nm market still needs to be strengthened through continuous technological improvements and yield enhancements.
Conclusion
Yield at the 2nm node has become a core indicator of competition in semiconductor foundry. TSMC maintains its lead in yield through technological accumulation and innovation; Intel has caught up through improvements in its 18A process; and Samsung needs to break through the bottleneck of its SF2 process. The speed at which each manufacturer improves yield in 2025 - 2026 will directly affect their market share distribution in high-growth markets such as AI chips and high-performance computing.
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