Model No: GD25Q16EWIGR
GigaDevice Semiconductor (HK) Limited GD25Q16EWIGR
Manufacturer: GigaDevice Semiconductor (HK) Limited
SEMICON NO.: GD25Q16EWIGR
Package: 8-WSON
Stock: In stock
Description: Serial NOR Flash Memory 16Mbit SPI-Quad I/O 133 MHz
SEMICON NO.: GD25Q16EWIGR
Package: 8-WSON
Stock: In stock
Description: Serial NOR Flash Memory 16Mbit SPI-Quad I/O 133 MHz
Quantity :
| Mfr | GigaDevice Semiconductor (HK) Limited |
| Device Type | Serial NOR Flash Memory |
| Technology | FLASH - NOR |
| Memory Size / Density | 16 Mbit (2 MByte) |
| Memory Organization | 2M x 8 |
| Interface Type | SPI - Quad I/O |
| Max Clock Frequency | 133 MHz |
| Max Access Time | 7 ns |
| Write Cycle Time | 70 µs, 2 ms |
| Supply Voltage | 2.7 V to 3.6 V |
| Operating Temperature | -40°C to +85° |
| Package | 8-WSON |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
The GD25Q16EWIGR is a 16‑Mbit serial NOR flash memory manufactured by GigaDevice, packaged in WSON‑8 tape‑and‑reel surface‑mount form, supporting standard, dual and quad SPI interfaces with maximum 133 MHz clock frequency, operating on 2.7 V‑3.6 V supply voltage across‑40 °C to +85 °C industrial temperature range, delivering fast page‑program and sector‑erase performance for firmware storage and non‑volatile data logging in compact embedded hardware.
Key Features
● Multi‑mode SPI interface including standard, dual‑I/O and quad‑I/O modes, supporting up to 133 MHz clock for high‑speed read operations to reduce system boot latency.
● 16‑Mbit memory organized as 2048 KB with 256‑byte programmable page size, featuring flexible 4 KB sector, 32 KB/64 KB block erase architecture for efficient partial memory update.
● Integrated hardware write‑protect pin, software reset function, OTP security registers and unique chip ID for firmware anti‑copying and secure configuration management.
● Low power consumption with micro‑ampere‑level power‑down current, high endurance of 100 K program‑erase cycles and 20‑year data retention for reliable long‑term storage.
● Compact WSON‑8 footprint with exposed thermal pad, RoHS compliant, suitable for space‑constrained PCB layouts for consumer and industrial devices.
This quad SPI NOR flash is widely adopted for MCU/SoC firmware storage, IoT device boot memory, wearable electronics, smart home modules, industrial sensor nodes, handheld consumer equipment and small embedded gateway hardware where compact size, fast boot‑up and stable non‑volatile code storage are essential requirements.
FAQ
Q: What are critical design tips for GD25Q16EWIGR?
A: Place decoupling capacitor close to power pin, match SPI signal trace length for quad‑SPI mode, respect maximum erase/program cycles, and avoid continuous power‑cycle stress to guarantee data retention performance.
Alternative SPI NOR flash Models
● GD25Q16CSIGR: 16‑Mbit SPI NOR flash in SOP‑8 package with equivalent electrical parameters, serving as footprint‑alternative for projects not requiring WSON‑8 compact package.
● W25Q16JVSSIQ: Winbond 16‑Mbit quad SPI flash with comparable speed and timing parameters, drop‑in compatible substitute for cross‑brand material replacement scenarios.
● GD25Q32EWIGR: WSON‑8 packaged 32‑Mbit NOR flash with identical pinout, providing doubled memory capacity for projects needing larger firmware storage space.