Model No: XCZU9CG-2FFVB1156E
AMD XCZU9CG-2FFVB1156E
Manufacturer: AMD
SEMICON NO.: XCZU9CG-2FFVB1156E
Package: 1156-FCBGA
Stock: In stock
Description: IC SOC ARM Cortex-A53 MPCore
SEMICON NO.: XCZU9CG-2FFVB1156E
Package: 1156-FCBGA
Stock: In stock
Description: IC SOC ARM Cortex-A53 MPCore
Quantity :
| Mfr | AMD |
| Product Family | Zynq® UltraScale+™ MPSoC CG |
| Device Type | SoC - FPGA |
| Architecture | MCU, FPGA |
| Application Processor | Quad-core ARM® Cortex®-A53 MPCore™ |
| Real-Time Processor | Dual-core ARM® Cortex™-R5 |
| Peripherals | DMA, WDT (Watchdog Timer) |
| Logic Cells | 599,550 (Approx. 599K+ Logic Cells) |
| Logic Array Blocks (LABs/ALMs) | 34,260 ALM |
| Total Block RAM | 32.1 Mbit |
| Distributed RAM | 8.8 Mbit |
| User I/O Count | 328 |
| High-Speed Transceivers | 24 Transceivers |
| Core Supply Voltage (VCCINT) | 0.85 V (nominal) |
| Operating Temperature (TJ) | 0°C to +100°C |
| Package | 1156-FCBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XCZU9CG-2FFVB1156E Zynq UltraScale+ MPSoC with Dual ARM Cortex-A53
The XCZU9CG-2FFVB1156E is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from AMD (formerly Xilinx), integrating dual-core ARM Cortex-A53 application processors and dual-core ARM Cortex-R5F real-time processors with UltraScale architecture programmable logic in a single device. Housed in a 1156-pin FCBGA (Fine-Pitch Ball Grid Array) package measuring 35mm × 35mm, this extended temperature range device delivers 599,550 system logic cells, 2,520 DSP slices, and 32.1 Mb block RAM, operating at -2 speed grade with 0.85V core voltage for high-performance embedded computing applications .
XCZU9CG-2FFVB1156E Key Features
• Heterogeneous Processing Architecture: Dual ARM Cortex-A53 @ 1.3GHz (APU) and dual ARM Cortex-R5F @ 533MHz (RPU)
• Massive Programmable Logic: 599,550+ system logic cells, 274,080 CLB LUTs, 548,160 flip-flops, and 24 GTH transceivers
• Rich Memory Resources: 256KB on-chip memory with ECC, 1MB shared L2 cache, 32.1 Mb block RAM
• Comprehensive Connectivity: USB 3.0, PCIe Gen3 x16, SATA 3.1, DisplayPort 1.2a, Gigabit Ethernet, and 640 user I/O pins
• Advanced Security: AES-GCM 256-bit decryption, SHA-384 hashing, eFUSE key storage, and tamper detection
• Extended Temperature Operation: 0°C to +100°C (E grade) junction temperature range for industrial applications.
Alternative Models
For designers seeking alternative Zynq UltraScale+ solutions, consider the XCZU9CG-2FFVB1156I which provides identical specifications with industrial temperature range (-40°C to +100°C) for harsher environments. The XCZU9CG-1FFVB1156E offers the same logic resources with -1 speed grade for cost-sensitive applications not requiring maximum performance. The XCZU9EG-2FFVB1156E adds ARM Mali-400 MP2 GPU for graphics and display-intensive applications. The XCZU7CG-2FFVC1156I provides reduced logic capacity (504K cells) in smaller 900-pin package for space-constrained designs. For higher performance requirements, the XCZU15EG-2FFVB1156E delivers 747K logic cells with enhanced DSP capabilities.
The XCZU9CG-2FFVB1156E is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from AMD (formerly Xilinx), integrating dual-core ARM Cortex-A53 application processors and dual-core ARM Cortex-R5F real-time processors with UltraScale architecture programmable logic in a single device. Housed in a 1156-pin FCBGA (Fine-Pitch Ball Grid Array) package measuring 35mm × 35mm, this extended temperature range device delivers 599,550 system logic cells, 2,520 DSP slices, and 32.1 Mb block RAM, operating at -2 speed grade with 0.85V core voltage for high-performance embedded computing applications .
XCZU9CG-2FFVB1156E Key Features
• Heterogeneous Processing Architecture: Dual ARM Cortex-A53 @ 1.3GHz (APU) and dual ARM Cortex-R5F @ 533MHz (RPU)
• Massive Programmable Logic: 599,550+ system logic cells, 274,080 CLB LUTs, 548,160 flip-flops, and 24 GTH transceivers
• Rich Memory Resources: 256KB on-chip memory with ECC, 1MB shared L2 cache, 32.1 Mb block RAM
• Comprehensive Connectivity: USB 3.0, PCIe Gen3 x16, SATA 3.1, DisplayPort 1.2a, Gigabit Ethernet, and 640 user I/O pins
• Advanced Security: AES-GCM 256-bit decryption, SHA-384 hashing, eFUSE key storage, and tamper detection
• Extended Temperature Operation: 0°C to +100°C (E grade) junction temperature range for industrial applications.
Alternative Models
For designers seeking alternative Zynq UltraScale+ solutions, consider the XCZU9CG-2FFVB1156I which provides identical specifications with industrial temperature range (-40°C to +100°C) for harsher environments. The XCZU9CG-1FFVB1156E offers the same logic resources with -1 speed grade for cost-sensitive applications not requiring maximum performance. The XCZU9EG-2FFVB1156E adds ARM Mali-400 MP2 GPU for graphics and display-intensive applications. The XCZU7CG-2FFVC1156I provides reduced logic capacity (504K cells) in smaller 900-pin package for space-constrained designs. For higher performance requirements, the XCZU15EG-2FFVB1156E delivers 747K logic cells with enhanced DSP capabilities.
