Model No: XCVU9P-2FLGB2104I
AMD XCVU9P-2FLGB2104I
Manufacturer: AMD
SEMICON NO.: XCVU9P-2FLGB2104I
Package: 2104-BBGA
Stock: In stock
Description: FPGA IC 702 391168000 2586150
SEMICON NO.: XCVU9P-2FLGB2104I
Package: 2104-BBGA
Stock: In stock
Description: FPGA IC 702 391168000 2586150
Quantity :
| Mfr | AMD |
| Product Family | Virtex® UltraScale+™ |
| Device Type | Field Programmable Gate Array (FPGA) |
| System Logic Cells | 2,586,150 |
| CLB Flip-Flops | 2,364,480 |
| CLB LUTs | 1,182,240 |
| DSP Slices (DSP48E2) | 6,840 |
| Total RAM Bits | 391,168,000 bits |
| Block RAM (BRAM) | 75.9 Mb |
| Number of GTY Transceivers | 120 |
| Max Transceiver Speed | 32.75 Gb/s |
| Transceiver Fractional PLLs | 60 |
| Maximum User I/Os | 778 |
| Max Operating Frequency | 725 MHz |
| I/O Supply Voltage | 3.3 V |
| Core Supply Voltage | 0.825 V to 0.876 V |
| Operating Temperature | -40°C to +100°C |
| Package | 2104-BBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XCVU9P-2FLGB2104IIndustrial FPGA Virtex UltraScale+ FPGA
The XCVU9P-2FLGB2104I is a flagship FPGA from AMD Xilinx Virtex UltraScale+ family, fabricated on 16 nm FinFET+ process technology. It delivers up to 2.58 million logic cells, 6,840 DSP slices, and rich on-chip memory, packaged in an industrial-grade FCBGA-2104 with speed grade -2 and operating junction temperature from -40°C to +100°C. Designed for compute-intensive and bandwidth-hungry workloads, this device integrates 32.75 Gbps GTY transceivers, PCIe Gen3 x16 / Gen4 x8 hard blocks, 100G Ethernet MAC with RS-FEC, and 150G Interlaken cores. With up to 128 x 32.75 Gbps transceivers, it provides massive serial bandwidth for optical transport, data-center interconnect, and 5G fronthaul. The XCVU9P-2FLGB2104I strikes an optimal balance between logic density, DSP throughput, and I/O flexibility, making it a preferred platform for ASIC prototyping, smart NICs, and high-performance signal processing.
The XCVU9P-2FLGB2104I targets the most demanding acceleration and communications workloads. In data centers, it powers smart NICs, NVMe offloading, and TCP/RoCE protocol acceleration over PCIe Gen3 x16 with 128 Gbps bidirectional bandwidth. For 5G wireless, it handles Massive MIMO beamforming, fronthaul/midhaul CPRI/eCPRI processing, and 400G/800G optical module FEC and traffic scheduling. Radar and defense systems leverage its 6,840 DSP slices for multi-channel pulse compression, Doppler filtering, and target tracking. In AI inference, the DSP fabric accelerates CNN and RNN models with FP32-to-INT8 quantization, offloading host CPUs and GPUs.
Alternative FPGA Models
● XCVU13P-2FHGB2104I: Higher-capacity Virtex UltraScale+ sibling with 3.78 M logic cells, 12,288 DSP slices, and 128 GTY transceivers for 800G-class workloads.
● XCVU5P-2FLVB2104I: Mid-range UltraScale+ option balancing cost and performance with fewer logic/DSP resources in the same 2104-ball footprint.
● XCVU190-2FLGB2104I: UltraScale+ device offering expanded logic and transceiver counts for large-scale prototyping and network processing.
● XCVU9P-2FLGA2104I: Same VU9P silicon in an FCBGA-2104A package variant for alternate PCB routing requirements.
● XCVU11P-2FLGB2104E: Commercial-grade UltraScale+ FPGA with VU9P-class resources and extended temperature support for flexible deployment.
The XCVU9P-2FLGB2104I is a flagship FPGA from AMD Xilinx Virtex UltraScale+ family, fabricated on 16 nm FinFET+ process technology. It delivers up to 2.58 million logic cells, 6,840 DSP slices, and rich on-chip memory, packaged in an industrial-grade FCBGA-2104 with speed grade -2 and operating junction temperature from -40°C to +100°C. Designed for compute-intensive and bandwidth-hungry workloads, this device integrates 32.75 Gbps GTY transceivers, PCIe Gen3 x16 / Gen4 x8 hard blocks, 100G Ethernet MAC with RS-FEC, and 150G Interlaken cores. With up to 128 x 32.75 Gbps transceivers, it provides massive serial bandwidth for optical transport, data-center interconnect, and 5G fronthaul. The XCVU9P-2FLGB2104I strikes an optimal balance between logic density, DSP throughput, and I/O flexibility, making it a preferred platform for ASIC prototyping, smart NICs, and high-performance signal processing.
The XCVU9P-2FLGB2104I targets the most demanding acceleration and communications workloads. In data centers, it powers smart NICs, NVMe offloading, and TCP/RoCE protocol acceleration over PCIe Gen3 x16 with 128 Gbps bidirectional bandwidth. For 5G wireless, it handles Massive MIMO beamforming, fronthaul/midhaul CPRI/eCPRI processing, and 400G/800G optical module FEC and traffic scheduling. Radar and defense systems leverage its 6,840 DSP slices for multi-channel pulse compression, Doppler filtering, and target tracking. In AI inference, the DSP fabric accelerates CNN and RNN models with FP32-to-INT8 quantization, offloading host CPUs and GPUs.
Alternative FPGA Models
● XCVU13P-2FHGB2104I: Higher-capacity Virtex UltraScale+ sibling with 3.78 M logic cells, 12,288 DSP slices, and 128 GTY transceivers for 800G-class workloads.
● XCVU5P-2FLVB2104I: Mid-range UltraScale+ option balancing cost and performance with fewer logic/DSP resources in the same 2104-ball footprint.
● XCVU190-2FLGB2104I: UltraScale+ device offering expanded logic and transceiver counts for large-scale prototyping and network processing.
● XCVU9P-2FLGA2104I: Same VU9P silicon in an FCBGA-2104A package variant for alternate PCB routing requirements.
● XCVU11P-2FLGB2104E: Commercial-grade UltraScale+ FPGA with VU9P-class resources and extended temperature support for flexible deployment.
