Model No: XCVU37P-2FSVH2892E

AMD XCVU37P-2FSVH2892E

Manufacturer: AMD
SEMICON NO.: XCVU37P-2FSVH2892E
Package: 2892-FCBGA
Stock: In stock
Description: IC FPGA 624 I/O 2892FCBGA
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 Mfr   AMD (Xilinx)
 Product Family / Series Virtex® UltraScale+™
 Architecture Process 16 nm FinFET+
 System Logic Cells (LEs) 2,851,800
 Configurable Logic Blocks (CLBs)   162,960
 Total RAM Bits  74,344,038 bits (约 8.9 MB)
 UltraRAM + Block RAM 340.9 Mb
 DSP Slices  9,024
 Maximum User I/O Count  624 HP I/O
 Integrated HBM DRAM 8 GB, up to 460 GB/s bandwidth
 High-Speed Transceivers   96 (GTY, up to 28.12 Gb/s each)
 Core Supply Voltage 0.825V ~ 0.876V (Nominal 0.85V)
 Operating Temperature 0°C ~ 100°C
 Package 2892-FCBGA
 Mounting Type Surface Mount (SMD/SMT) 
 Compliance     RoHS Compliant
XCVU37P-2FSVH2892E FPGA Solutions
The XCVU37P-2FSVH2892E is a flagship FPGA from Xilinx's Virtex UltraScale+ family, engineered for ultra-high-performance, data-intensive applications requiring massive bandwidth and low latency.   Built on a 16nm FinFET process, it integrates 16GB of HBM2 memory across 8 independent channels, delivering up to 460GB/s bandwidth, ideal for AI acceleration, 5G networking, and real-time analytics.
The FPGA features 2.85 million logic cells, 16,296 LUTs, and 624 I/Os, supporting complex parallel processing tasks.   With dedicated DSP slices for high-speed signal processing, it excels in radar, medical imaging, and scientific computing.   Its PCIe, Ethernet, and optical interconnects ensure seamless integration into high-speed data pipelines, while hardware security modules (trusted boot, encryption) protect intellectual property.   The FPGA's dynamic reconfiguration enables runtime logic updates without disrupting operations, enhancing flexibility in mission-critical systems.
XCVU37P-2FSVH2892E FPGA Key Features
● Memory & Bandwidth: 16GB HBM2 (8 channels, 2GB each) with 460GB/s bandwidth reduces latency for AI/ML and HPC workloads.
● Logic & Processing: 2.85M logic cells and 16,296 LUTs support large-scale designs;   DSP slices optimize for signal/image processing.
● Connectivity: PCIe Gen4/5, 100G Ethernet, and QSFP28 optical interfaces enable high-speed data transfer in networking and data centers.
● Security: On-chip encryption and secure boot safeguard against unauthorized access.
● Power & Thermal: Advanced power management (0.825–0.876V core voltage) and PowerPAD packaging optimize thermal efficiency.
AlternativeHigh-Bandwidth FPGA Models
● XCVU13P-2FHGA2104E: Mid-range FPGA with 1.3M logic cells and 4GB HBM2, balancing performance and power for 5G and edge computing.
● XCVU9P-2FLGA2104E: Lower-cost option with 900K logic cells and 2GB HBM2, suited for industrial automation and medical imaging.
● XCVU47P-2FSVH2892E: Higher-end variant with 4.7M logic cells and 32GB HBM2, designed for exascale computing and AI training clusters.
● XCVU5P-1FLVA2104E: Compact FPGA with 500K logic cells, targeting cost-optimized aerospace and defense applications.