Model No: XCKU060-FFVA1156
AMD XCKU060-FFVA1156
Manufacturer: AMD
SEMICON NO.: XCKU060-FFVA1156
Package: 1156-BBGA
Stock: In stock
Description: FPGA IC 520 38912000 725550
SEMICON NO.: XCKU060-FFVA1156
Package: 1156-BBGA
Stock: In stock
Description: FPGA IC 520 38912000 725550
Quantity :
| Mfr | AMD |
| Product Family | Kintex® UltraScale™ |
| Device Type | FPGA |
| Logic Cells / Elements | 725,550 |
| Logic Array Blocks (LABs/CLBs) | 41,460 |
| CLBs (Configurable Logic Blocks) | 2,760 |
| Registers / Flip-Flops | 663,360 |
| Total RAM Bits | 38,912,000 bits |
| Maximum User I/O Pins | 520 |
| Total I/O Pins (Physical) | 624 |
| Supply Voltage (Vccint) | 0.922 V to 0.979 V |
| I/O Voltage (Max) | 3.3 V |
| Operating Temperature | -40°C to +100°C |
| Package | 1156-BBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XCKU060-FFVA1156 FPGA IC Kintex UltraScale FPGA
The XCKU060-FFVA1156 is a high-performance Field-Programmable Gate Array (FPGA) from AMD's (formerly Xilinx) Kintex UltraScale family, designed to deliver an optimal balance of logic capacity, DSP performance, and high-speed connectivity for mid-range to high-end applications . This monolithic device, built on a 20nm process technology (or 16nm FinFET+ for UltraScale+ variants), features 725,550 system logic cells (equivalent to 331,680 CLB LUTs and 663,360 flip-flops) and is housed in a 1156-ball Fine-Pitch Ball Grid Array (FCBGA) package . It operates within a wide temperature range of -40°C to 100°C and is powered by a core voltage ranging from 0.922V to 0.979V, making it suitable for demanding industrial and commercial environments .
From a technical specification perspective, the XCKU060-FFVA1156 provides substantial on-chip resources for complex digital designs: 725,550 logic cells, 1,080 blocks of 36Kb RAM (totaling 38 Mb), 2,760 DSP slices, and 32 transceiver channels . The transceivers support major protocols such as PCIe Gen3 x8, 10GBASE-R Ethernet, CPRI, JESD204B, and SATA 3.0 . The device's power efficiency is enhanced by advanced power management features, and its monolithic die construction avoids the timing complexities associated with multi-die (SSI) devices, simplifying high-speed design closure .
The primary applications for the XCKU060-FFVA1156 span across industries that require high-throughput data processing and real-time signal handling. It is extensively used in telecommunications infrastructure for 5G wireless basebands and optical transport networks, in data centers for hardware acceleration and network function virtualization, and in aerospace/defense systems for radar and secure communications . Furthermore, its capabilities are leveraged in test and measurement equipment, medical imaging systems for real-time reconstruction, broadcast video processing for 4K/8K streams, and industrial automation for high-precision motion control .
Alternative FPGA Models
● Intel (Altera) Stratix 10 GX FPGA: A high-performance FPGA family built on Intel's 14nm Tri-Gate process, featuring high core performance, high-speed transceivers up to 28 Gbps, and embedded hard processor systems for demanding compute and networking applications .
● Intel (Altera) Arria 10 GX FPGA: A mid-range FPGA offering a balance of performance, power efficiency, and cost, with transceivers up to 17.4 Gbps and hardened floating-point DSP blocks, ideal for wireless infrastructure and broadcast systems .
● Lattice Semiconductor ECP5 FPGA: A low-power, small-form-factor FPGA family built on 40nm technology, offering high I/O density, embedded SERDES, and a cost-effective solution for connectivity, bridging, and control applications .
● Microchip (Microsemi) SmartFusion2 SoC FPGA: A system-on-chip (SoC) FPGA that integrates a hardened ARM Cortex-M3 processor with flash-based FPGA fabric and advanced security features, targeting industrial, military, and communications applications requiring high reliability.
The XCKU060-FFVA1156 is a high-performance Field-Programmable Gate Array (FPGA) from AMD's (formerly Xilinx) Kintex UltraScale family, designed to deliver an optimal balance of logic capacity, DSP performance, and high-speed connectivity for mid-range to high-end applications . This monolithic device, built on a 20nm process technology (or 16nm FinFET+ for UltraScale+ variants), features 725,550 system logic cells (equivalent to 331,680 CLB LUTs and 663,360 flip-flops) and is housed in a 1156-ball Fine-Pitch Ball Grid Array (FCBGA) package . It operates within a wide temperature range of -40°C to 100°C and is powered by a core voltage ranging from 0.922V to 0.979V, making it suitable for demanding industrial and commercial environments .
From a technical specification perspective, the XCKU060-FFVA1156 provides substantial on-chip resources for complex digital designs: 725,550 logic cells, 1,080 blocks of 36Kb RAM (totaling 38 Mb), 2,760 DSP slices, and 32 transceiver channels . The transceivers support major protocols such as PCIe Gen3 x8, 10GBASE-R Ethernet, CPRI, JESD204B, and SATA 3.0 . The device's power efficiency is enhanced by advanced power management features, and its monolithic die construction avoids the timing complexities associated with multi-die (SSI) devices, simplifying high-speed design closure .
The primary applications for the XCKU060-FFVA1156 span across industries that require high-throughput data processing and real-time signal handling. It is extensively used in telecommunications infrastructure for 5G wireless basebands and optical transport networks, in data centers for hardware acceleration and network function virtualization, and in aerospace/defense systems for radar and secure communications . Furthermore, its capabilities are leveraged in test and measurement equipment, medical imaging systems for real-time reconstruction, broadcast video processing for 4K/8K streams, and industrial automation for high-precision motion control .
Alternative FPGA Models
● Intel (Altera) Stratix 10 GX FPGA: A high-performance FPGA family built on Intel's 14nm Tri-Gate process, featuring high core performance, high-speed transceivers up to 28 Gbps, and embedded hard processor systems for demanding compute and networking applications .
● Intel (Altera) Arria 10 GX FPGA: A mid-range FPGA offering a balance of performance, power efficiency, and cost, with transceivers up to 17.4 Gbps and hardened floating-point DSP blocks, ideal for wireless infrastructure and broadcast systems .
● Lattice Semiconductor ECP5 FPGA: A low-power, small-form-factor FPGA family built on 40nm technology, offering high I/O density, embedded SERDES, and a cost-effective solution for connectivity, bridging, and control applications .
● Microchip (Microsemi) SmartFusion2 SoC FPGA: A system-on-chip (SoC) FPGA that integrates a hardened ARM Cortex-M3 processor with flash-based FPGA fabric and advanced security features, targeting industrial, military, and communications applications requiring high reliability.
