Model No: XC7Z035-2FFG676I
AMD XC7Z035-2FFG676I
Manufacturer: AMD
SEMICON NO.: XC7Z035-2FFG676I
Package: 676-FCBGA
Stock: In stock
Description: IC SoC 32-bit 2 Cores 800 MHz 256 KB RAM
SEMICON NO.: XC7Z035-2FFG676I
Package: 676-FCBGA
Stock: In stock
Description: IC SoC 32-bit 2 Cores 800 MHz 256 KB RAM
Quantity :
| Mfr | AMD |
| Product Family | Zynq®-7000 |
| Device Type | All Programmable System-on-Chip (SoC) |
| Core Size | 32-bit, 2 Cores |
| Maximum CPU Speed | 800 MHz |
| On-Chip Memory | 256 KB RAM |
| DSP Slices | 220 |
| Block RAM | 19.2 Mb |
| Maximum User I/O Pins | 130 |
| Core Supply Voltage | 1.0V (Core), 0.9V/1.0V/1.8V/3.3V |
| I/O Supply Voltage | 1.2V to 3.3V |
| Operating Temperature | -40°C to +100°C |
| Package | 676-FCBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XC7Z035-2FFG676I Zynq-7000 SoC
The XC7Z035-2FFG676I from AMD/Xilinx is a high-performance Zynq-7000 All Programmable SoC integrating a dual-core ARM Cortex-A9 MPCore processing system with Kintex-7 programmable logic on a single 28 nm die, housed in a 676-ball FCBGA package measuring 27 mm by 27 mm and rated for industrial temperature operation. It supports processor clocks up to 800 MHz, while the programmable logic delivers 275,000 logic cells, 171,900 slice LUTs, 900 DSP48E1 slices, and 17.6 Mb of block RAM for demanding parallel computation and hardware acceleration. Sixteen GTX serial transceivers provide multi-gigabit connectivity up to 12.5 Gbps, supporting protocols such as PCIe Gen2, 10 GbE, CPRI, and SATA, while internal high-bandwidth AXI buses eliminate board-level latency between the processor and FPGA fabric. The device operates across a junction temperature range of -40 degrees C to +100 degrees C, making it suitable for harsh-environment embedded systems requiring long-term reliability.
The XC7Z035-2FFG676I excels across embedded systems requiring high computational throughput and deterministic real-time control, including software-defined radio, radar signal processing, medical imaging such as digital ultrasound and MRI post-processing, machine vision inspection, and multi-axis robotics controllers. It is ideally suited for high-definition video broadcasting switches, real-time 4K transcoding, professional audio matrices, avionics systems, and advanced military electronics where integrated processing and reconfigurable logic reduce board complexity. The device also serves communication infrastructure, industrial automation, autonomous driving platforms, and high-speed data acquisition systems.
Alternative SoC IC Options
1. The AMD Xilinx XC7Z045-2FFG676I is a pin-compatible upgrade within the same Zynq-7000 family, delivering 350,000 logic cells and enhanced DSP resources in an identical 676-ball FCBGA footprint for designs requiring greater programmable logic capacity.
2. The AMD Xilinx XC7Z030-2FFG676I provides a cost-optimized alternative in the same package with reduced logic resources and fewer transceivers, suitable for mid-range embedded applications that do not require the full resource set.
3. The Intel 5CSEBA6U23I7NDK Cyclone V SE SoC integrates a dual-core ARM Cortex-A9 MPCore running at up to 925 MHz with Cyclone V FPGA fabric, offering a mature ecosystem with independent hard processor system boot and dynamic partial reconfiguration capabilities.
4. The Microchip MPFS250T-FCVG484EES PolarFire SoC combines a deterministic five-core RISC-V processor cluster with 254,000 low-power logic elements and 12.7 Gbps SERDES, delivering significantly lower power consumption for energy-sensitive industrial and aerospace applications.
The XC7Z035-2FFG676I from AMD/Xilinx is a high-performance Zynq-7000 All Programmable SoC integrating a dual-core ARM Cortex-A9 MPCore processing system with Kintex-7 programmable logic on a single 28 nm die, housed in a 676-ball FCBGA package measuring 27 mm by 27 mm and rated for industrial temperature operation. It supports processor clocks up to 800 MHz, while the programmable logic delivers 275,000 logic cells, 171,900 slice LUTs, 900 DSP48E1 slices, and 17.6 Mb of block RAM for demanding parallel computation and hardware acceleration. Sixteen GTX serial transceivers provide multi-gigabit connectivity up to 12.5 Gbps, supporting protocols such as PCIe Gen2, 10 GbE, CPRI, and SATA, while internal high-bandwidth AXI buses eliminate board-level latency between the processor and FPGA fabric. The device operates across a junction temperature range of -40 degrees C to +100 degrees C, making it suitable for harsh-environment embedded systems requiring long-term reliability.
The XC7Z035-2FFG676I excels across embedded systems requiring high computational throughput and deterministic real-time control, including software-defined radio, radar signal processing, medical imaging such as digital ultrasound and MRI post-processing, machine vision inspection, and multi-axis robotics controllers. It is ideally suited for high-definition video broadcasting switches, real-time 4K transcoding, professional audio matrices, avionics systems, and advanced military electronics where integrated processing and reconfigurable logic reduce board complexity. The device also serves communication infrastructure, industrial automation, autonomous driving platforms, and high-speed data acquisition systems.
Alternative SoC IC Options
1. The AMD Xilinx XC7Z045-2FFG676I is a pin-compatible upgrade within the same Zynq-7000 family, delivering 350,000 logic cells and enhanced DSP resources in an identical 676-ball FCBGA footprint for designs requiring greater programmable logic capacity.
2. The AMD Xilinx XC7Z030-2FFG676I provides a cost-optimized alternative in the same package with reduced logic resources and fewer transceivers, suitable for mid-range embedded applications that do not require the full resource set.
3. The Intel 5CSEBA6U23I7NDK Cyclone V SE SoC integrates a dual-core ARM Cortex-A9 MPCore running at up to 925 MHz with Cyclone V FPGA fabric, offering a mature ecosystem with independent hard processor system boot and dynamic partial reconfiguration capabilities.
4. The Microchip MPFS250T-FCVG484EES PolarFire SoC combines a deterministic five-core RISC-V processor cluster with 254,000 low-power logic elements and 12.7 Gbps SERDES, delivering significantly lower power consumption for energy-sensitive industrial and aerospace applications.
