Model No: XC7Z010-1CLG400I
AMD XC7Z010-1CLG400I
Manufacturer: AMD
SEMICON NO.: XC7Z010-1CLG400I
Package: 400-CSPBGA
Stock: In stock
Description: Embedded SoC IC Zynq-7000 Artix™-7 FPGA
SEMICON NO.: XC7Z010-1CLG400I
Package: 400-CSPBGA
Stock: In stock
Description: Embedded SoC IC Zynq-7000 Artix™-7 FPGA
Quantity :
| Mfr | AMD |
| Product Family | Zynq®-7000 SoC |
| Device Type | All Programmable System-on-Chip (AP SoC) |
| Core Size | 32-bit, 2 Cores |
| Maximum CPU Speed | 667 MHz |
| On-Chip Memory | 256KB RAM |
| External Memory Support | DDR3, DDR3L, DDR2, LPDDR2 |
| DSP Slices | 80 |
| General Connectivity | 2x CAN 2.0B, 2x I²C, 2x SPI, 2x UART |
| DMA Controller | 8-Channel |
| Operating Temperature | -40°C to +100°C |
| Package | 400-CSPBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XC7Z010-1CLG400I AMD Xilinx Zynq-7000 All Programmable SoC Chip
XC7Z010-1CLG400I is industrial-grade hybrid all-programmable SoC from AMD Xilinx Zynq-7000 product line built on mature 28nm CMOS manufacturing process, packaged in compact 17×17mm 400-ball CLG400 CSPLFBGA SMD housing with industrial junction temperature rating ranging from -40°C to +100°C, integrating dual-core ARM Cortex-A9 MPCore processing system running at fixed 667MHz alongside Artix-7 based programmable logic fabric containing 28000 logic cells, embedded block RAM and dedicated DSP slices, equipped with total 130 user-configurable I/O pins, core nominal operating voltage at 1.0V with tolerance between 0.95V and 1.05V, fully compliant with RoHS restriction standards and MSL3 moisture sensitivity specification to guarantee stable automated SMT production assembly for rugged industrial environments.
Cortex-A9 FPGA SOC Features and Applications
This single-chip integrated device adopts high-speed multi-channel AXI interconnect architecture to achieve low-latency bidirectional data transmission between software-centric processing system and reconfigurable hardware programmable logic, where embedded PS subsystem carries 256KB on-chip SRAM and abundant native peripherals including Gigabit Ethernet, USB OTG, CAN, SPI, UART, I2C and SDIO interfaces plus built-in 12-bit XADC analog monitoring module supporting multi-channel voltage and temperature detection, while PL section delivers flexible parallel computing resources for custom DSP algorithm acceleration, adjustable multi-voltage I/O rails from 1.2V to 3.3V and configurable low-power sleep modes to reduce idle power consumption for battery-operated embedded hardware design.
It acts as core master control chip extensively deployed on compact industrial PLC control modules, servo motor drive controllers, miniature embedded vision preprocessing units, low-power IoT edge gateway equipment, portable medical diagnostic testing instruments and cost-effective entry-level software-defined radio front-end boards, perfectly balancing ARM software programming flexibility and FPGA hardware parallel acceleration advantages to satisfy mid-volume cost-sensitive embedded development and product iteration demands.
Alternative industrial SoCs
● XC7Z020-1CLG400I(Xilinx): Pin-to-pin compatible 400-CSPBGA Zynq variant retaining identical dual-Cortex-A9 PS structure with upgraded 85K PL logic cells to expand programmable resource without modifying existing PCB layout for upgraded system development.
● XC7Z010-1CLG225I(Xilinx): Same core processor configuration in smaller 225-ball LFBGA footprint to shrink finished PCB dimension for ultra-miniaturized embedded product downsizing design.
● GW5A-100IQFP(Gowin): Domestic ARM+FPGA hybrid SoC with equivalent industrial temperature range and compatible mainstream peripheral interfaces to serve as economical second-source replacement amid original component supply shortage scenarios.
XC7Z010-1CLG400I is industrial-grade hybrid all-programmable SoC from AMD Xilinx Zynq-7000 product line built on mature 28nm CMOS manufacturing process, packaged in compact 17×17mm 400-ball CLG400 CSPLFBGA SMD housing with industrial junction temperature rating ranging from -40°C to +100°C, integrating dual-core ARM Cortex-A9 MPCore processing system running at fixed 667MHz alongside Artix-7 based programmable logic fabric containing 28000 logic cells, embedded block RAM and dedicated DSP slices, equipped with total 130 user-configurable I/O pins, core nominal operating voltage at 1.0V with tolerance between 0.95V and 1.05V, fully compliant with RoHS restriction standards and MSL3 moisture sensitivity specification to guarantee stable automated SMT production assembly for rugged industrial environments.
Cortex-A9 FPGA SOC Features and Applications
This single-chip integrated device adopts high-speed multi-channel AXI interconnect architecture to achieve low-latency bidirectional data transmission between software-centric processing system and reconfigurable hardware programmable logic, where embedded PS subsystem carries 256KB on-chip SRAM and abundant native peripherals including Gigabit Ethernet, USB OTG, CAN, SPI, UART, I2C and SDIO interfaces plus built-in 12-bit XADC analog monitoring module supporting multi-channel voltage and temperature detection, while PL section delivers flexible parallel computing resources for custom DSP algorithm acceleration, adjustable multi-voltage I/O rails from 1.2V to 3.3V and configurable low-power sleep modes to reduce idle power consumption for battery-operated embedded hardware design.
It acts as core master control chip extensively deployed on compact industrial PLC control modules, servo motor drive controllers, miniature embedded vision preprocessing units, low-power IoT edge gateway equipment, portable medical diagnostic testing instruments and cost-effective entry-level software-defined radio front-end boards, perfectly balancing ARM software programming flexibility and FPGA hardware parallel acceleration advantages to satisfy mid-volume cost-sensitive embedded development and product iteration demands.
Alternative industrial SoCs
● XC7Z020-1CLG400I(Xilinx): Pin-to-pin compatible 400-CSPBGA Zynq variant retaining identical dual-Cortex-A9 PS structure with upgraded 85K PL logic cells to expand programmable resource without modifying existing PCB layout for upgraded system development.
● XC7Z010-1CLG225I(Xilinx): Same core processor configuration in smaller 225-ball LFBGA footprint to shrink finished PCB dimension for ultra-miniaturized embedded product downsizing design.
● GW5A-100IQFP(Gowin): Domestic ARM+FPGA hybrid SoC with equivalent industrial temperature range and compatible mainstream peripheral interfaces to serve as economical second-source replacement amid original component supply shortage scenarios.
