Model No: XC7S50-2CSGA324
AMD XC7S50-2CSGA324
Manufacturer: AMD
SEMICON NO.: XC7S50-2CSGA324
Package: 324-CSBGA
Stock: In stock
Description: IC FPGA 210 I/O 324CSBGA
SEMICON NO.: XC7S50-2CSGA324
Package: 324-CSBGA
Stock: In stock
Description: IC FPGA 210 I/O 324CSBGA
Quantity :
| Mfr | AMD |
| Product Family | Spartan®-7 |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Cells / Logic Elements | 52,160 |
| Logic Array Blocks (LABs/CLBs) | 4,075 |
| Total RAM Bits | 2,764,800 bits |
| Distributed RAM | 600 kbit |
| Embedded Block RAM (EBR/BRAM) | 2,700 kbit |
| User I/O Pins | 210 |
| Max LVDS Data Rate | Up to 1.06 Gb/s |
| Clock Management | MMCM and PLL |
| Core Supply Voltage (Vccint) | 0.95 V to 1.05 V |
| I/O Supply Voltage (Vcco) | Up to 3.3 V |
| Operating Temperature | -40°C to +100°C |
| Package | 324-CSBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XC7S50-2CSGA324 AMD Xilinx Spartan-7 Cost-Optimized FPGA
XC7S50-2CSGA324 belongs to AMD Xilinx Spartan-7 SRAM-based FPGA family fabricated on mature 28nm low-power process technology, packaged in 324-ball CSGA surface-mount tray packaging with MSL3 moisture rating and full RoHS compliance for automated mass SMT PCB assembly, classified as commercial grade for junction temperatures ranging from 0°C to +85°C. This mid-density programmable logic chip holds 52,160 logic cells, 2.7Mbit embedded block RAM, 80 DSP48E1 arithmetic slices for digital signal acceleration, 16 differential I/O pairs and 210 total single-ended user I/Os, paired with four MMCM clock management modules for precise frequency synthesis and low-skew clock distribution. It runs on a 1.0V core supply with flexible I/O bank voltages supporting 1.2V up to 3.3V multi-level logic standards, balancing compact ball package size, moderate logic capacity and affordable pricing for cost-sensitive embedded reconfigurable hardware designs.
Spartan-7 FPGA Applications
It serves as the central reconfigurable logic controller deployed widely in industrial motor drive control boards, multi-channel data acquisition systems, compact protocol conversion gateways, portable test measurement instruments, low-resolution image capture processing units, and small-scale communication interface adapters, offering reliable mid-density programmable performance to replace expensive ASICs and higher-tier FPGAs for low-to-medium complexity industrial and commercial embedded electronic systems.
Alternative FPGA Models
● XC7S50-2CSGA324I (Xilinx): Pin-compatible industrial temperature variant operating from -40°C to +100°C for harsh environment direct PCB drop-in replacement.
● LFE5U-45F-6BG256C (Lattice): Flash-based low-power FPGA with comparable logic capacity and instant-on startup as cross-brand second-source substitute.
● 10M04SAF324C8G (Intel Cyclone 10): Cost-effective Intel FPGA with matching ball package footprint and compatible I/O standards for mass production design switching.
XC7S50-2CSGA324 belongs to AMD Xilinx Spartan-7 SRAM-based FPGA family fabricated on mature 28nm low-power process technology, packaged in 324-ball CSGA surface-mount tray packaging with MSL3 moisture rating and full RoHS compliance for automated mass SMT PCB assembly, classified as commercial grade for junction temperatures ranging from 0°C to +85°C. This mid-density programmable logic chip holds 52,160 logic cells, 2.7Mbit embedded block RAM, 80 DSP48E1 arithmetic slices for digital signal acceleration, 16 differential I/O pairs and 210 total single-ended user I/Os, paired with four MMCM clock management modules for precise frequency synthesis and low-skew clock distribution. It runs on a 1.0V core supply with flexible I/O bank voltages supporting 1.2V up to 3.3V multi-level logic standards, balancing compact ball package size, moderate logic capacity and affordable pricing for cost-sensitive embedded reconfigurable hardware designs.
Spartan-7 FPGA Applications
It serves as the central reconfigurable logic controller deployed widely in industrial motor drive control boards, multi-channel data acquisition systems, compact protocol conversion gateways, portable test measurement instruments, low-resolution image capture processing units, and small-scale communication interface adapters, offering reliable mid-density programmable performance to replace expensive ASICs and higher-tier FPGAs for low-to-medium complexity industrial and commercial embedded electronic systems.
Alternative FPGA Models
● XC7S50-2CSGA324I (Xilinx): Pin-compatible industrial temperature variant operating from -40°C to +100°C for harsh environment direct PCB drop-in replacement.
● LFE5U-45F-6BG256C (Lattice): Flash-based low-power FPGA with comparable logic capacity and instant-on startup as cross-brand second-source substitute.
● 10M04SAF324C8G (Intel Cyclone 10): Cost-effective Intel FPGA with matching ball package footprint and compatible I/O standards for mass production design switching.
