Model No: XC7A100T-2FGG676I
AMD XC7A100T-2FGG676I
Manufacturer: Texas Instruments
SEMICON NO.: XC7A100T-2FGG676I
Package: 676-BGA
Stock: In stock
Description: Artix-7 FPGA IC 300 4976640 101440
SEMICON NO.: XC7A100T-2FGG676I
Package: 676-BGA
Stock: In stock
Description: Artix-7 FPGA IC 300 4976640 101440
Quantity :
| Mfr | AMD |
| Product Family | Artix-7 |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements / Cells | 101,440 |
| Logic Array Blocks (LABs/CLBs) | 7,925 |
| Slices | 15,850 |
| Registers / Flip-Flops | 126,800 |
| Total RAM Bits | 4,976,640 bits |
| Block RAM (BRAM) | 4,860 kbit |
| Distributed RAM | 1,188 kbit |
| Number of Transceivers (GTP) | 8 |
| Transceiver Speed (Max) | Up to 6.6 Gb/s |
| Maximum User I/O Pins | 300 |
| Operating Frequency (Max) | 628 MHz (Internal) |
| I/O Supply Voltage (Vcco) | 1.2V to 3.3V |
| Core Supply Voltage (Vccint) | 0.95 V to 1.05 V |
| Operating Temperature | -40°C to +100° |
| Package | 676-BGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XC7A100T-2FGG676I Artix-7 FPGA
The XC7A100T-2FGG676I is a mid-range, low-power Artix-7 FPGA from Xilinx (AMD), built on a 28nm high-k metal gate (HKMG) process, delivering optimized performance and cost efficiency for high-volume, logic-intensive applications. It features 101,440 logic cells, 16.2 Mb of block RAM, 240 DSP slices, and 300 user I/Os, housed in a 676-ball FCBGA (27x27mm) package with an industrial temperature range of -40°C to 100°C. The device supports core voltages of 0.95V to 1.05V, integrates multi-gigabit transceivers up to 12.5 Gbps, and complies with RoHS standards, making it ideal for compact, high-speed systems.
Key Features and Applications
This FPGA combines high logic capacity with low power consumption, including 8 clock management tiles (CMTs) for precise clock synthesis, distribution, and jitter filtering, supporting frequencies up to 628 MHz. It offers flexible I/O banks compatible with LVCMOS, LVDS, and other common standards, plus integrated AES-256 encryption and SEU error correction for enhanced design security and reliability. The -2 speed grade provides balanced timing performance, while the FCBGA package ensures excellent thermal dissipation and solder joint reliability for industrial and commercial deployments.
It is widely used in communication infrastructure such as routers, switches, and wireless base stations for high-speed data processing and protocol acceleration. It serves industrial automation, motor control, and HMI systems, implementing complex control algorithms and real-time signal processing with its abundant DSP resources. Additionally, it is applied in medical imaging, automotive ADAS, and high-end consumer electronics, where its combination of logic density, I/O count, and low power enables compact, high-performance designs.
Alternative industrial FPGAs
● Intel Cyclone V 5CSEMA5F31C6N: 85K logic elements, 15.4 Mb RAM, 184 DSP blocks, 624-pin BGA, low-power FPGA for industrial and communication applications.
● Lattice ECP3-70E-6FN484C: 70K LUTs, 6.8 Mb RAM, 192 DSP slices, 484-BGA, cost-effective FPGA with high I/O bandwidth for embedded systems.
● Microsemi SmartFusion2 M2S150-FGG676: 150K logic cells, 16 Mb RAM, 216 DSP blocks, 676-FBGA, FPGA with integrated ARM Cortex-M3 for secure, low-power designs.
The XC7A100T-2FGG676I is a mid-range, low-power Artix-7 FPGA from Xilinx (AMD), built on a 28nm high-k metal gate (HKMG) process, delivering optimized performance and cost efficiency for high-volume, logic-intensive applications. It features 101,440 logic cells, 16.2 Mb of block RAM, 240 DSP slices, and 300 user I/Os, housed in a 676-ball FCBGA (27x27mm) package with an industrial temperature range of -40°C to 100°C. The device supports core voltages of 0.95V to 1.05V, integrates multi-gigabit transceivers up to 12.5 Gbps, and complies with RoHS standards, making it ideal for compact, high-speed systems.
Key Features and Applications
This FPGA combines high logic capacity with low power consumption, including 8 clock management tiles (CMTs) for precise clock synthesis, distribution, and jitter filtering, supporting frequencies up to 628 MHz. It offers flexible I/O banks compatible with LVCMOS, LVDS, and other common standards, plus integrated AES-256 encryption and SEU error correction for enhanced design security and reliability. The -2 speed grade provides balanced timing performance, while the FCBGA package ensures excellent thermal dissipation and solder joint reliability for industrial and commercial deployments.
It is widely used in communication infrastructure such as routers, switches, and wireless base stations for high-speed data processing and protocol acceleration. It serves industrial automation, motor control, and HMI systems, implementing complex control algorithms and real-time signal processing with its abundant DSP resources. Additionally, it is applied in medical imaging, automotive ADAS, and high-end consumer electronics, where its combination of logic density, I/O count, and low power enables compact, high-performance designs.
Alternative industrial FPGAs
● Intel Cyclone V 5CSEMA5F31C6N: 85K logic elements, 15.4 Mb RAM, 184 DSP blocks, 624-pin BGA, low-power FPGA for industrial and communication applications.
● Lattice ECP3-70E-6FN484C: 70K LUTs, 6.8 Mb RAM, 192 DSP slices, 484-BGA, cost-effective FPGA with high I/O bandwidth for embedded systems.
● Microsemi SmartFusion2 M2S150-FGG676: 150K logic cells, 16 Mb RAM, 216 DSP blocks, 676-FBGA, FPGA with integrated ARM Cortex-M3 for secure, low-power designs.
