Model No: XC6VLX75T-1FF484I
AMD XC6VLX75T-1FF484I
Manufacturer: AMD
SEMICON NO.: XC6VLX75T-1FF484I
Package: 484-BBGA
Stock: In stock
Description: IC Virtex-6 LXT Field Programmable Gate Array
SEMICON NO.: XC6VLX75T-1FF484I
Package: 484-BBGA
Stock: In stock
Description: IC Virtex-6 LXT Field Programmable Gate Array
Quantity :
| Mfr | AMD |
| Logic Cells | 74,496 |
| Slices | 11,640 |
| CLB Flip-Flops | 93,120 |
| Block RAM (36Kb blocks) | 312 blocks |
| Maximum Distributed RAM | 1,470 Kb |
| DSP48E1 Slices | 288 |
| GTX Transceivers | 8 |
| PCI Express® Endpoint Block | Integrated |
| Clock Management Tiles (CMT) | 6 |
| Maximum User I/Os | 328 |
| I/O Standards | Supports LVDS, SSTL, HSTL, LVCMOS, etc. |
| Supply Voltage (Core, VCCINT) | 1.0V |
| Supply Voltage (Auxiliary, VCCAUX) | 2.5V |
| Operating Temperature | –40 °C to +100 °C |
| Package | 484-BBGA |
| Mounting Type | Surface Mount (SMD/SMT) |
| Compliance | RoHS Compliant |
XC6VLX75T-1FF484I Virtex-6 LXT FPGA IC Field Programmable Gate Array
XC6VLX75T-1FF484I is a mid-density, high-performance FPGA from AMD's Virtex-6 LXT family, offering 74 496 logic cells, 11 640 adaptive-logic modules, 5.48 Mbit of integrated block RAM and 240 selectable I/Os in a compact 484-FCBGA package that is qualified for –40 °C to +100 °C junction operation. Fabricated on a 1 V-core, 40 nm CMOS process, the device delivers up to 600 MHz fabric performance while consuming 30 % less power than previous 65 nm generations, and integrates eight 3.75 Gb/s GTX serial transceivers with built-in 8b/10b, comma-align and pre-emphasis logic, making it a single-chip solution for bridging, packet processing and image-processing applications that demand both parallel logic density and multi-gigabit serial bandwidth.
XC6VLX75T-1FF484I Applications
● Automotive camera ECUs
● Industrial machine-vision frame-grabbers
● Software-defined radio (SDR) base-stations
● Broadcast video edge mixers
● Medical ultrasound beam-formers
AlternativeFPGA Models
1. Intel/Altera EP4SGX70HF35C2G – 72k logic elements, twelve 3.2 Gb/s GXB transceivers, 6.4 Gb/s PCIe Gen-2 hard-IP, 40 nm, 896-pin FBGA, ideal when Stratix IV GX ecosystem is preferred.
2. Lattice LFE5UM-85F-8BG756C – 84k LUTs, four 3.2 Gb/s SERDES lanes, low-power 28 nm FD-SOI process, 10 × 10 mm package, cost-optimised for small-cell and edge-AI cameras.
3. Microsemi RTG4 RT4G150-CG1657 – 150k logic elements, 24 × 5 Gb/s SERDES, radiation-tolerant 65 nm flash process, suitable for space-grade SDR and satellite payloads.
4. AMD/XC7A75T-1FGG484I – 75k logic cells, Artix-7 28 nm, eight 6.6 Gb/s GTX, 1.2 V core, drop-in 484-ball footprint upgrade for lower-power or higher-speed requirements.
5. QuickLogic QL5G-48511 – 55k LUTs, eFPGA hard-macro on 22 nm FDSOI, customisable for SoC integration where discrete FPGA BOM is prohibited.
XC6VLX75T-1FF484I is a mid-density, high-performance FPGA from AMD's Virtex-6 LXT family, offering 74 496 logic cells, 11 640 adaptive-logic modules, 5.48 Mbit of integrated block RAM and 240 selectable I/Os in a compact 484-FCBGA package that is qualified for –40 °C to +100 °C junction operation. Fabricated on a 1 V-core, 40 nm CMOS process, the device delivers up to 600 MHz fabric performance while consuming 30 % less power than previous 65 nm generations, and integrates eight 3.75 Gb/s GTX serial transceivers with built-in 8b/10b, comma-align and pre-emphasis logic, making it a single-chip solution for bridging, packet processing and image-processing applications that demand both parallel logic density and multi-gigabit serial bandwidth.
XC6VLX75T-1FF484I Applications
● Automotive camera ECUs
● Industrial machine-vision frame-grabbers
● Software-defined radio (SDR) base-stations
● Broadcast video edge mixers
● Medical ultrasound beam-formers
AlternativeFPGA Models
1. Intel/Altera EP4SGX70HF35C2G – 72k logic elements, twelve 3.2 Gb/s GXB transceivers, 6.4 Gb/s PCIe Gen-2 hard-IP, 40 nm, 896-pin FBGA, ideal when Stratix IV GX ecosystem is preferred.
2. Lattice LFE5UM-85F-8BG756C – 84k LUTs, four 3.2 Gb/s SERDES lanes, low-power 28 nm FD-SOI process, 10 × 10 mm package, cost-optimised for small-cell and edge-AI cameras.
3. Microsemi RTG4 RT4G150-CG1657 – 150k logic elements, 24 × 5 Gb/s SERDES, radiation-tolerant 65 nm flash process, suitable for space-grade SDR and satellite payloads.
4. AMD/XC7A75T-1FGG484I – 75k logic cells, Artix-7 28 nm, eight 6.6 Gb/s GTX, 1.2 V core, drop-in 484-ball footprint upgrade for lower-power or higher-speed requirements.
5. QuickLogic QL5G-48511 – 55k LUTs, eFPGA hard-macro on 22 nm FDSOI, customisable for SoC integration where discrete FPGA BOM is prohibited.
