Model No: XC6VLX240T-1FFG1156C
AMD XC6VLX240T-1FFG1156C
Manufacturer: AMD
SEMICON NO.: XC6VLX240T-1FFG1156C
Package: 1156-BBGA
Stock: In stock
Description: IC FPGA Virtex-6 LXT 600 500mhz
SEMICON NO.: XC6VLX240T-1FFG1156C
Package: 1156-BBGA
Stock: In stock
Description: IC FPGA Virtex-6 LXT 600 500mhz
Quantity :
| Mfr | AMD |
| Product Family | Virtex®-6 LXT |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements / Cells | 241,152 |
| Logic Array Blocks (LABs/CLBs) | 18,840 |
| Adaptive Logic Modules (ALMs) | 37,680 ALM |
| Registers / Flip-Flops | 480,000 registers |
| Total RAM Bits | 15,335,424 bits |
| Distributed RAM | 3,650 kbit |
| Embedded Block RAM (EBR) | 14,976 kbit |
| Maximum User I/O Pins | 600 |
| Maximum Operating Frequency | 550 MHz |
| Maximum Clock Frequency | 1.6 GHz |
| Data Rate (Transceivers) | 6.6 Gb/s |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Operating Temperature | 0°C to +85°C |
| Package | 1156-BBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
XC6VLX240T-1FFG1156C Virtex-6 LXT High-Performance FPGA
The XC6VLX240T-1FFG1156C is a high-density field-programmable gate array from AMD/Xilinx's Virtex®-6 LXT family, fabricated on a 40-nm copper process technology and optimized for high-performance logic and DSP with low-power serial connectivity. This commercial-grade device operates over a 0°C to +85°C temperature range and is supplied in a 1156-ball FCBGA package (35×35 mm), offering a compelling balance of logic density, embedded memory, and high-speed transceiver capability for demanding system-on-chip designs in communications, medical imaging, defense, and wired networking infrastructure.
At the heart of this FPGA lies a massive programmable fabric comprising 241,152 logic elements (equivalent to approximately 240,000 logic cells), organized into 18,840 Configurable Logic Blocks (CLBs) / LABs. Also, it integrates substantial on-chip memory resources totaling 15,335,424 bits of total RAM, comprising 14,976 Kbits of embedded block RAM (36 Kbit dual-port blocks) and 3,650 Kbits of distributed RAM. With 600 user-configurable I/O pins, this FPGA supports a wide range of single-ended and differential I/O standards including LVCMOS and HSTL, enabling broad system integration and multi-channel interface connectivity.
Alternative FPGAs
● XC6VLX240T-2FFG1156C – Same logic capacity and package with a faster -2 speed grade offering improved performance for timing-critical designs.
● XC6VLX240T-1FFG1156I – Identical specifications and package but rated for the industrial temperature range of -40°C to +100°C for extended environmental operation.
● XC6VLX240T-1FF1759C – Larger 1759-ball FCBGA package (42.5×42.5 mm) with 720 I/O pins for designs requiring maximum connectivity.
● XC6VLX130T-1FFG1156C – Lower-density alternative with approximately 128,000 logic elements in the same 1156-pin package for cost-sensitive applications.
● XC6VSX315T-1FFG1156C – Virtex-6 SXT family device with enhanced DSP resources (over 700 DSP slices) in the identical 1156-pin footprint for DSP-intensive workloads.
The XC6VLX240T-1FFG1156C is a high-density field-programmable gate array from AMD/Xilinx's Virtex®-6 LXT family, fabricated on a 40-nm copper process technology and optimized for high-performance logic and DSP with low-power serial connectivity. This commercial-grade device operates over a 0°C to +85°C temperature range and is supplied in a 1156-ball FCBGA package (35×35 mm), offering a compelling balance of logic density, embedded memory, and high-speed transceiver capability for demanding system-on-chip designs in communications, medical imaging, defense, and wired networking infrastructure.
At the heart of this FPGA lies a massive programmable fabric comprising 241,152 logic elements (equivalent to approximately 240,000 logic cells), organized into 18,840 Configurable Logic Blocks (CLBs) / LABs. Also, it integrates substantial on-chip memory resources totaling 15,335,424 bits of total RAM, comprising 14,976 Kbits of embedded block RAM (36 Kbit dual-port blocks) and 3,650 Kbits of distributed RAM. With 600 user-configurable I/O pins, this FPGA supports a wide range of single-ended and differential I/O standards including LVCMOS and HSTL, enabling broad system integration and multi-channel interface connectivity.
Alternative FPGAs
● XC6VLX240T-2FFG1156C – Same logic capacity and package with a faster -2 speed grade offering improved performance for timing-critical designs.
● XC6VLX240T-1FFG1156I – Identical specifications and package but rated for the industrial temperature range of -40°C to +100°C for extended environmental operation.
● XC6VLX240T-1FF1759C – Larger 1759-ball FCBGA package (42.5×42.5 mm) with 720 I/O pins for designs requiring maximum connectivity.
● XC6VLX130T-1FFG1156C – Lower-density alternative with approximately 128,000 logic elements in the same 1156-pin package for cost-sensitive applications.
● XC6VSX315T-1FFG1156C – Virtex-6 SXT family device with enhanced DSP resources (over 700 DSP slices) in the identical 1156-pin footprint for DSP-intensive workloads.
