Model No: XC6SLX150-3FGG676C
AMD XC6SLX150-3FGG676C
Manufacturer: AMD
Semicon NO: XC6SLX150-3FGG676C
Package: 676-BGA
Stock: In stock
Description: XC6SLX150-3FGG676C(Kg)
Semicon NO: XC6SLX150-3FGG676C
Package: 676-BGA
Stock: In stock
Description: XC6SLX150-3FGG676C(Kg)
Quantity :
| Parameters | |
|---|---|
| Mfr | AMD |
| Series | Spartan®-6 LX |
| Package | Tray |
| Product Status | Active |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 11519 |
| Number of Logic Elements/Cells | 147443 |
| Total RAM Bits | 4939776 |
| Number of I/O | 498 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Base Product Number | XC6SLX150 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
| Standard Package | 40 |
The XC6SLX150-3FGG676C is a field programmable gate array (FPGA) in Xilinx's Spartan®-6 LX family. Designed for high performance, low power consumption and optimized cost, this FPGA is suitable for applications that require complex logic and flexible I/O. The XC6SLX150-3FGG676C has 498 input/output (I/O) interfaces and is packaged in a 676-FBGA package, providing a wealth of connectivity options. With a supply voltage range of 1.14V to 1.26V and an operating temperature range of 0°C to 85°C(TJ), it is suitable for use under a variety of environmental conditions. In addition, the chip has 150 logic units and is manufactured in a 32nm process, which combines low power consumption and high performance, so it has a wide range of applications in high-performance computing, communications, image processing and digital signal processing.
Features:
- 498 I/O interfaces in 676-FBGA package
- Power supply voltage 1.14V to 1.26V
- Operating temperature 0°C to 85°C(TJ)
- Efficient integration blocks and optimized I/O standard selection
- Supports hot swap compliance
- Supports data transfer rates up to 3.2Gb /s
- With sleep power off mode to achieve zero power consumption
Applications:
Communication system: as the core of protocol processing and data conversion in communication equipment.
Industrial control: Used in automation control systems and motor drives.
Video processing: plays a role in video capture, codec and other applications
Automotive electronics: infotainment systems and safety control systems used in automobiles.
Digital signal processing: Used to implement complex signal processing algorithms.
Test and measurement: Used in high-speed data acquisition and real-time signal analysis.
Features:
- 498 I/O interfaces in 676-FBGA package
- Power supply voltage 1.14V to 1.26V
- Operating temperature 0°C to 85°C(TJ)
- Efficient integration blocks and optimized I/O standard selection
- Supports hot swap compliance
- Supports data transfer rates up to 3.2Gb /s
- With sleep power off mode to achieve zero power consumption
Applications:
Communication system: as the core of protocol processing and data conversion in communication equipment.
Industrial control: Used in automation control systems and motor drives.
Video processing: plays a role in video capture, codec and other applications
Automotive electronics: infotainment systems and safety control systems used in automobiles.
Digital signal processing: Used to implement complex signal processing algorithms.
Test and measurement: Used in high-speed data acquisition and real-time signal analysis.