Model No: XC3S700A-5FGG484C
AMD XC3S700A-5FGG484C
Manufacturer: AMD
SEMICON NO.: XC3S700A-5FGG484C
Package: 484-BBGA
Stock: In stock
Description: IC FPGA 372 368640 13248 484FBGA
SEMICON NO.: XC3S700A-5FGG484C
Package: 484-BBGA
Stock: In stock
Description: IC FPGA 372 368640 13248 484FBGA
Quantity :
| Mfr | AMD/Xilinx |
| Type | FPGA (Field Programmable Gate Array) |
| Series | Spartan®-3A |
| Programmable Logic Type | CMOS, 90nm Technology |
| Number of CLBs | 1472 |
| Number of Logic Cells | 13,248 |
| Total RAM Bits | 368,640 (45 kB) |
| Number of I/Os | 372 |
| Equivalent Gates | 700,000 |
| Max Clock Frequency | 667 MHz |
| Supply Voltage Range | 1.14V – 1.26V (1.2V nominal) |
| Operating Temperature | -40°C to +100°C |
| Package | 484-BBGA |
| Mounting Type | Surface Mount (SMD) |
| Compliance | RoHS compliant, lead-free |
XC3S700A-4FGG484I Spartan®-3A Field Programmable Gate Array
The XC3S700A-4FGG484I is a high-performance Field Programmable Gate Array (FPGA) from the Spartan-3A family, designed for a wide range of applications requiring extensive logic capacity and flexibility. This FPGA features 700,000 system gates and 13,248 configurable logic blocks, providing extensive logic capacity and flexibility for complex digital designs.
XC3S700A-4FGG484I Features and Specifications
The XC3S700A-4FGG484I operates with a supply voltage range of 1.14V to 1.26V and supports a wide operating temperature range from -40°C to +100°C. It includes a total of 368,640 RAM bits and 372 I/Os, making it suitable for applications requiring high memory capacity and extensive I/O capabilities. The device is packaged in a 484-pin Fine Ball Grid Array (FBGA), which is ideal for surface-mount technology and compact designs.
XC3S700A-4FGG484I Applications
This FPGA is well-suited for various applications, including industrial automation, telecommunications, consumer electronics, and automotive systems. Its high logic capacity and configurable logic blocks make it ideal for complex digital designs, such as digital signal processing, control systems, and embedded systems. The XC3S700A-4FGG484I is also commonly used in broadband technology and other high-speed applications.
AlternativeXilinx FPGA Models
● XC3S700A-4FGG400C: This model features a 400-pin BGA package and similar logic capacity, making it a suitable alternative for applications requiring a smaller form factor.
● XC3S700AN-4FGG484I: This variant is also a 484-pin FBGA package but may offer slight differences in performance or packaging specifications, making it suitable for specific application requirements.
● XC3S500E-4FGG320C: This model has fewer gates (500,000) and a 320-pin BGA package, making it a cost-effective option for applications with lower logic requirements.
