Model No: XC3S400-4TQG144I

AMD XC3S400-4TQG144I

Manufacturer: AMD
SEMICON NO.: XC3S400-4TQG144I
Package: 144-TQFP
Stock: In stock
Description: IC FPGA Spartan-3 400000 System Gate 1.2V
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 Mfr    AMD 
 Device Type  Field Programmable Gate Array (FPGA)    
 Technology / Process   90 nm CMOS    
 Logic Elements / Cells 8,064    
 Logic Array Blocks (LABs/CLBs) 896    
 System Gates   400,000    
 Total RAM Bits   294,912 bits
 Distributed RAM   Included
 Maximum User I/O Pins 97    
 Maximum Clock Frequency 630 MHz    
 Combinatorial CLB Delay 0.61 ns (max)    
 Core Supply Voltage (Vccint)  1.14 V to 1.26 V 
 Auxiliary Supply Voltage (Vccaux)  2.5 V to 3.3 V    
 I/O Supply Voltage (Vcco)   1.14 V to 3.465 V
 Operating Temperature -40°C to 100°C
 Package 144-TQFP
 Mounting Type Surface Mount
 Compliance    
 RoHS Compliant
XC3S400-4TQG144I Xilinx (AMD) Spartan-3 FPGA, 144-LQFP
XC3S400-4TQG144I is a cost-effective, high-performance SRAM-based FPGA from Xilinx (AMD) Spartan-3 family, built on 90nm process technology with 400K system gates, 8064 logic cells, and 294,912 bits of embedded RAM. It is housed in a 144-LQFP (TQFP-144, 20×20mm) surface-mount package, delivering 97 user I/Os and operating at a core voltage of 1.14V–1.26V, with an industrial temperature range of -40°C to +100°C (TJ). This device features four digital clock managers (DCMs) for clock synthesis and skew control, along with support for up to 622+ Mb/s I/O data rates and 18 single-ended/8 differential I/O standards including LVDS and RSDS.
Spartan-3 FPGA Features and Applications
This FPGA integrates a rich set of resources: 896 configurable logic blocks (CLBs), 1,872 Kbit block RAM, 520 Kbit distributed RAM, and dedicated 18×18 multipliers for DSP-intensive tasks. It supports DDR/DDR2 SDRAM interfaces up to 333 Mb/s and includes JTAG boundary scan (IEEE 1149.1/1532) for testing and configuration. The SelectIO™ interface provides digital control impedance termination, while eight global clock lines ensure high-speed, low-skew clock distribution. It is fully compatible with Xilinx ISE/WebPACK tools and supports embedded cores like MicroBlaze™ and PicoBlaze™ for system-on-chip (SoC) designs.
It is widely used in cost-sensitive, medium-complexity applications such as industrial motor controllers, automotive infotainment systems, consumer electronics, and communication protocol bridges. It also serves as a core component in medical devices, test equipment, and legacy embedded systems requiring reliable, reconfigurable logic with moderate I/O count and DSP capabilities.
Alternative programmable logic chips
● LCMXO2-4000HC-4TG144I (Lattice): Flash-based FPGA with 4320 logic cells, 115 I/Os, and TQFP-144 package, offering instant-on operation and single-chip configuration as a drop-in replacement.
● XC3S400-4TQG144C (Xilinx): Commercial-grade variant with 0°C to +85°C temperature range, identical logic resources and pinout for cost-optimized designs.
● 10M04SAE144I7G (Intel/Altera): Low-cost Cyclone-series FPGA with 4K logic elements, 96 I/Os, and LQFP-144 package, supporting similar I/O standards and toolchain compatibility.