Model No: EP4CE30F23C8N
Altera EP4CE30F23C8N
Manufacturer: Altera
SEMICON NO.: EP4CE30F23C8N
Package: 484-BGA
Stock: In stock
Description: Cyclone® IV E FPGA IC 328 608256 28848
SEMICON NO.: EP4CE30F23C8N
Package: 484-BGA
Stock: In stock
Description: Cyclone® IV E FPGA IC 328 608256 28848
Quantity :
| Mfr | Altera |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements (LEs) / Cells | 28,848 |
| Logic Array Blocks (LABs/CLBs) | 1,803 |
| Total RAM Bits | 608,256 bits |
| M9K Memory Blocks | 102 |
| DSP Blocks | 66 |
| Phase-Locked Loops (PLLs) | 4 |
| Maximum Internal Frequency | 472.5 MHz |
| Maximum User I/O Pins | 328 |
| Core Supply Voltage (Vccint) | 1.15 V to 1.25 V |
| Supply Voltage (Nominal) | 1.2V (Core), 1.2/2.5/3.3V (I/O) |
| Operating Temperature | 0°C to +85° |
| Package | 484-BGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
EP4CE30F23C8N Cyclone IV E FPGA
The EP4CE30F23C8N is a mid-range Cyclone® IV E FPGA from Intel (formerly Altera), featuring 29,440 logic elements (LEs), 594 embedded 18×18 multipliers, and 1,134 Kbits of total embedded memory organized as 133 M9K blocks. Housed in a 484-pin FineLine BGA (FBGA) package measuring 23 mm × 23 mm with a 1.0 mm ball pitch, this device operates from a 1.2 V core supply with 3.3 V, 2.5 V, or 1.8 V I/O banks, and is specified for commercial temperature range (0 °C to +85 °C) with a speed grade of –8 (typical fMAX ~240 MHz on global clock networks). The Cyclone IV E family is optimized for low power consumption and cost-sensitive high-logic-density applications, and the EP4CE30F23C8N provides up to 328 user I/O pins across its four I/O banks, supporting LVCMOS, LVTTL, SSTL, HSTL, and differential signaling standards including LVDS at up to 875 Mbps per channel. With four PLLs for clock multiplication/phase shifting, dedicated DDR/DDR2/QDRII memory interface support, and on-chip termination (OCT/Rs OCT), it is a popular choice for bridging, protocol conversion, DSP co-processing, and glue logic consolidation in industrial, communications, and video applications.
TheEP4CE30F23C8N is extensively used in:
●Industrial control and automation: implements custom state machines, encoder decoders, multi-axis servo interfaces, and safety interlock logic that would be uneconomical in ASIC or large CPLD.
●Video and image processing front-ends: buffers, formats, and preprocesses camera data (debayer, color space convert) before passing to an SoC or GPU.
●Communications and protocol bridging: translates between SPI/I²C/UART and parallel buses, or implements glue logic between mismatched interfaces in test equipment.
●DSP coprocessing: offloads repetitive multiply-accumulate operations from a host processor in cost-sensitive instrumentation.
Alternative FPGAs
1. EP4CE30F23I8N: Intel Cyclone IV E FPGA in the same 484-FBGA package with identical 29,440 LEs and memory, but specified for industrial temperature range (–40 °C to +100 °C), pin-compatible and drop-in replaceable for extended-environment designs.
2. EP4CE30F23C7N: Faster –7 speed grade version of the EP4CE30 in 484-FBGA and commercial temp, offering higher performance margin for timing-critical designs while retaining full pin and resource compatibility.
3. EP4CE15F23C8N: Smaller-member Cyclone IV E with ~15,408 LEs and roughly half the block RAM in the same 484-FBGA footprint, useful as a cost-reduced alternative when logic/memory needs are lower.
4. EP4CE40F23C8N: Larger Cyclone IV E with ~39,600 LEs and increased DSP/M9K in the same package.
The EP4CE30F23C8N is a mid-range Cyclone® IV E FPGA from Intel (formerly Altera), featuring 29,440 logic elements (LEs), 594 embedded 18×18 multipliers, and 1,134 Kbits of total embedded memory organized as 133 M9K blocks. Housed in a 484-pin FineLine BGA (FBGA) package measuring 23 mm × 23 mm with a 1.0 mm ball pitch, this device operates from a 1.2 V core supply with 3.3 V, 2.5 V, or 1.8 V I/O banks, and is specified for commercial temperature range (0 °C to +85 °C) with a speed grade of –8 (typical fMAX ~240 MHz on global clock networks). The Cyclone IV E family is optimized for low power consumption and cost-sensitive high-logic-density applications, and the EP4CE30F23C8N provides up to 328 user I/O pins across its four I/O banks, supporting LVCMOS, LVTTL, SSTL, HSTL, and differential signaling standards including LVDS at up to 875 Mbps per channel. With four PLLs for clock multiplication/phase shifting, dedicated DDR/DDR2/QDRII memory interface support, and on-chip termination (OCT/Rs OCT), it is a popular choice for bridging, protocol conversion, DSP co-processing, and glue logic consolidation in industrial, communications, and video applications.
TheEP4CE30F23C8N is extensively used in:
●Industrial control and automation: implements custom state machines, encoder decoders, multi-axis servo interfaces, and safety interlock logic that would be uneconomical in ASIC or large CPLD.
●Video and image processing front-ends: buffers, formats, and preprocesses camera data (debayer, color space convert) before passing to an SoC or GPU.
●Communications and protocol bridging: translates between SPI/I²C/UART and parallel buses, or implements glue logic between mismatched interfaces in test equipment.
●DSP coprocessing: offloads repetitive multiply-accumulate operations from a host processor in cost-sensitive instrumentation.
Alternative FPGAs
1. EP4CE30F23I8N: Intel Cyclone IV E FPGA in the same 484-FBGA package with identical 29,440 LEs and memory, but specified for industrial temperature range (–40 °C to +100 °C), pin-compatible and drop-in replaceable for extended-environment designs.
2. EP4CE30F23C7N: Faster –7 speed grade version of the EP4CE30 in 484-FBGA and commercial temp, offering higher performance margin for timing-critical designs while retaining full pin and resource compatibility.
3. EP4CE15F23C8N: Smaller-member Cyclone IV E with ~15,408 LEs and roughly half the block RAM in the same 484-FBGA footprint, useful as a cost-reduced alternative when logic/memory needs are lower.
4. EP4CE40F23C8N: Larger Cyclone IV E with ~39,600 LEs and increased DSP/M9K in the same package.
