Model No: EP3C10E144C8N
Altera EP3C10E144C8N
Manufacturer: Altera
SEMICON NO.: EP3C10E144C8N
Package: 144-LQFP
Stock: In stock
Description: FPGA Cyclone® III IC 94 423936 10320
SEMICON NO.: EP3C10E144C8N
Package: 144-LQFP
Stock: In stock
Description: FPGA Cyclone® III IC 94 423936 10320
Quantity :
| Mfr | Altera |
| Product Family | Cyclone® III |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements (LEs) / Cells | 10,320 |
| Logic Array Blocks (LABs/CLBs) | 645 |
| Embedded Multipliers (18x18) | 23 |
| Total RAM Bits | 423,936 bits (414 Kbit) |
| Maximum User I/O Pins | 94 |
| Maximum Operating Frequency | 315 MHz or 402 MHz |
| Differential Channels | Up to 70 |
| Phase-Locked Loops (PLLs) | 2 |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Supply Voltage (VCCIO) | 3.3 V |
| Operating Temperature | 0°C to +85°C |
| Package | 144-LQFP |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
EP3C10E144C8N Cyclone III FPGA
The EP3C10E144C8N is a member of the Altera Cyclone III FPGA family, built on TSMC’s 65 nm low-power process and offering a balanced combination of 10,320 logic elements, 423,936 bits of embedded M9K memory, 18×18 multipliers, and 94 user I/O in a 144‑pin EQFP package with an exposed pad for improved thermal performance and power distribution. Designed for cost‑sensitive, low‑power applications, it operates from a 1.15 V to 1.25 V core supply across 0°C to 85°C and supports a broad set of single‑ended and differential I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, and more), along with on‑chip termination and adjustable slew rates to simplify board‑level signal integrity.
Embedded processing and IP integration are well supported through the Nios II soft processor and a broad portfolio of verified IP cores, enabling compact, customizable implementations across consumer, industrial, communications, and automotive domains. With 645 logic array blocks, up to 22 differential channels in the E144 package, and static power consumption below a quarter watt, the EP3C10E144C8N suits battery‑operated and thermally constrained designs while delivering up to 402 MHz performance for moderate‑throughput signal processing, bridging, and control tasks.
Alternative cost‑optimized FPGA Models
● AMD/Xilinx XC6SLX9-2TQG144C: A Spartan‑6 LX FPGA with 9,152 logic elements, 576 Kb RAM, and up to 102 user I/O in a 144‑pin LQFP package, suitable for cost‑optimized bridging and glue logic.
● Microchip A3P060-1TQG144: A ProASIC3 flash FPGA offering 60,000 system gates, 18,432 bits of RAM, 91 I/O, and 1.425–1.575 V supply in a 144‑TQFP package, with instant‑on, secure, nonvolatile configuration.
The EP3C10E144C8N is a member of the Altera Cyclone III FPGA family, built on TSMC’s 65 nm low-power process and offering a balanced combination of 10,320 logic elements, 423,936 bits of embedded M9K memory, 18×18 multipliers, and 94 user I/O in a 144‑pin EQFP package with an exposed pad for improved thermal performance and power distribution. Designed for cost‑sensitive, low‑power applications, it operates from a 1.15 V to 1.25 V core supply across 0°C to 85°C and supports a broad set of single‑ended and differential I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, and more), along with on‑chip termination and adjustable slew rates to simplify board‑level signal integrity.
Embedded processing and IP integration are well supported through the Nios II soft processor and a broad portfolio of verified IP cores, enabling compact, customizable implementations across consumer, industrial, communications, and automotive domains. With 645 logic array blocks, up to 22 differential channels in the E144 package, and static power consumption below a quarter watt, the EP3C10E144C8N suits battery‑operated and thermally constrained designs while delivering up to 402 MHz performance for moderate‑throughput signal processing, bridging, and control tasks.
Alternative cost‑optimized FPGA Models
● AMD/Xilinx XC6SLX9-2TQG144C: A Spartan‑6 LX FPGA with 9,152 logic elements, 576 Kb RAM, and up to 102 user I/O in a 144‑pin LQFP package, suitable for cost‑optimized bridging and glue logic.
● Microchip A3P060-1TQG144: A ProASIC3 flash FPGA offering 60,000 system gates, 18,432 bits of RAM, 91 I/O, and 1.425–1.575 V supply in a 144‑TQFP package, with instant‑on, secure, nonvolatile configuration.
