Model No: 5SGXEA3K2F40C2N
Altera 5SGXEA3K2F40C2N
Manufacturer: Altera
SEMICON NO.: 5SGXEA3K2F40C2N
Package: 1517-FBGA
Stock: In stock
Description: FPGA Stratix V GX 128,300 696
SEMICON NO.: 5SGXEA3K2F40C2N
Package: 1517-FBGA
Stock: In stock
Description: FPGA Stratix V GX 128,300 696
Quantity :
| Mfr | Altera |
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Stratix® V GX |
| Logic Elements (LEs) | 340,000 |
| Logic Array Blocks (LABs/CLBs) | 128,300 |
| Total RAM Bits | 19,456,000 bits |
| Total Memory | 22.92 Mbit |
| Embedded Block RAM (EBR) | 3.92 Mbit |
| Maximum User I/O | 696 |
| Data Rate (Transceivers) | 14.1 Gb/s |
| Number of Transceivers | 36 |
| Supply Voltage | 0.87 V to 0.93 V |
| Operating Supply Voltage | 0.85 V |
| Operating Temperature | 0°C to +85°C |
| Package | 1517-FBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
The 5SGXEA3K2F40C2N is a high-performance mid-range Arria V GX FPGA from Intel (Altera), housed in a 1517-pin 40x40mm FCBGA surface-mount package. It integrates 340,000 logic elements, 23.7Mb embedded RAM, and multiple high-speed transceivers, supporting 0.9V core supply and 0°C to 70°C commercial operating temperature range, making it a highly flexible parallel processing solution for high-throughput communication, industrial signal processing, and high-density embedded system designs.
Key Features and Highlights
● 340,000 High-Density Logic Elements: 340K adaptive logic modules deliver massive parallel processing resources, supporting complex custom logic, DSP acceleration, and multi-core embedded system implementation on a single chip.
● 23.7Mb Large Embedded Block RAM: Abundant on-chip high-speed memory resources eliminate external memory access bottlenecks, enabling efficient real-time data buffering and FIFO operations for high-throughput signal processing pipelines.
● 696 User-Configurable I/O Pins: Massive general-purpose I/O count supports flexible interfacing with multiple external memory chips, high-speed ADC/DAC modules, and various industrial communication peripherals simultaneously.
● High-Speed Transceiver Integration: Native multi-gigabit serial transceiver support enables direct implementation of PCIe, Gigabit Ethernet, and SDR high-speed communication protocols without external PHY chips.
● 340,000 High-Density Logic Elements: 340K adaptive logic modules deliver massive parallel processing resources, supporting complex custom logic, DSP acceleration, and multi-core embedded system implementation on a single chip.
● 23.7Mb Large Embedded Block RAM: Abundant on-chip high-speed memory resources eliminate external memory access bottlenecks, enabling efficient real-time data buffering and FIFO operations for high-throughput signal processing pipelines.
● 696 User-Configurable I/O Pins: Massive general-purpose I/O count supports flexible interfacing with multiple external memory chips, high-speed ADC/DAC modules, and various industrial communication peripherals simultaneously.
● High-Speed Transceiver Integration: Native multi-gigabit serial transceiver support enables direct implementation of PCIe, Gigabit Ethernet, and SDR high-speed communication protocols without external PHY chips.
Frequently Asked Questions (FAQ)
Q: Can this FPGA support DDR3 high-speed external memory interfacing?
A: Yes, its dedicated hard memory controller blocks and high-performance I/O banks natively support DDR3 and DDR4 memory interfaces at high clock speeds for large-capacity external data buffering.
Q: Can this FPGA support DDR3 high-speed external memory interfacing?
A: Yes, its dedicated hard memory controller blocks and high-performance I/O banks natively support DDR3 and DDR4 memory interfaces at high clock speeds for large-capacity external data buffering.
Compatible Alternative FPGA Part List
● 5SGXEA3K3F40I2N: The extended industrial -40°C to +100°C temperature grade variant of the same FPGA, supporting deployment in harsh outdoor industrial and near-equipment high-temperature scenarios.
● XC7K325T-2FFG900C: A Xilinx Kintex-7 FPGA, serving as a fully cross-vendor second-source alternative with comparable logic density and high-speed transceiver performance.
● 5SGXMA3K2F40C2N: The Arria V GX lower-power variant, featuring optimized power consumption design for energy-sensitive portable high-performance embedded system applications.
● 10AX032K2F40E2SG: An Intel Arria 10 mid-range FPGA, offering higher logic density and faster transceiver speed for next-generation high-throughput communication system upgrades.
● 5SGXEA3K3F40I2N: The extended industrial -40°C to +100°C temperature grade variant of the same FPGA, supporting deployment in harsh outdoor industrial and near-equipment high-temperature scenarios.
● XC7K325T-2FFG900C: A Xilinx Kintex-7 FPGA, serving as a fully cross-vendor second-source alternative with comparable logic density and high-speed transceiver performance.
● 5SGXMA3K2F40C2N: The Arria V GX lower-power variant, featuring optimized power consumption design for energy-sensitive portable high-performance embedded system applications.
● 10AX032K2F40E2SG: An Intel Arria 10 mid-range FPGA, offering higher logic density and faster transceiver speed for next-generation high-throughput communication system upgrades.
