Model No: 10M08SAU169C8G
Altera 10M08SAU169C8G
Manufacturer: Altera
SEMICON NO.: 10M08SAU169C8G
Package: 169-LFBGA
Stock: In stock
Description: MAX 10 FPGA IC 130 387072 8000
SEMICON NO.: 10M08SAU169C8G
Package: 169-LFBGA
Stock: In stock
Description: MAX 10 FPGA IC 130 387072 8000
Quantity :
| Mfr | Altera |
| Product Family | MAX 10 |
| Device Type | Field Programmable Gate Array (FPGA) |
| Technology / Process | 55 nm |
| Logic Elements / Cells | 8000 |
| Logic Array Blocks (LABs/CLBs) | 500 |
| Total RAM Bits | 387,072 bits (378 kbit) |
| User Flash Memory | 8 Kbits |
| Maximum User I/O Pins | 130 |
| Maximum Internal Frequency | 450 MHz (max), 169 MHz (operating speed) |
| Core Supply Voltage (Vcc) | 2.85V to 3.465V |
| Operating Temperature | 0°C to 85°C |
| Package | 169-LFBGA |
| Mounting Type | Surface Mount |
| Compliance | RoHS Compliant |
10M08SAU169C8G MAX 10 FPGA
The10M08SAU169C8G is a high-performance non-volatile FPGA from Intel's MAX 10 family, delivering 8,000 logic elements and approximately 80,000 system gates in a compact 169-ball Ultra Ball Grid Array (UBGA) package measuring 11mm × 11mm with 0.8mm pitch. Manufactured using TSMC's 55nm embedded flash process technology, this device features instant-on capability with less than 10ms setup time, eliminating the need for external configuration memory and providing secure on-die flash storage for intellectual property protection. Operating from a core voltage of 1.2V with I/O voltages supporting 3.3V, 2.5V, and 1.8V standards, the device operates across commercial temperature range of 0°C to +85°C with maximum clock frequencies up to 450 MHz. The integrated analog-to-digital converter (ADC) enables system monitoring capabilities without external components, making this FPGA ideal for cost-sensitive applications requiring both digital processing and analog sensing.
ThisMAX 10 FPGA incorporates comprehensive security features including AES-128 bit encryption for configuration bitstream protection, JTAG Secure Mode to prevent unauthorized access, and One-Time Programmable (OTP) fuses for permanent security settings. The FPGA chip supports single-chip Nios II soft-core processor implementation, enabling complete embedded system integration without external processors. Power management features include a dedicated sleep mode that dramatically reduces standby current consumption, making the device suitable for battery-operated and power-sensitive applications. The flash-based configuration eliminates external boot memory costs while providing infinite reconfigurability for field upgrades and design iterations.
Alternative embedded ADC FPGAs
● 10M16SAU169C8G: Higher-density MAX 10 variant offering 16,000 logic elements with 98% pin compatibility, suitable for designs requiring expanded resources but introducing 40% higher static power consumption.
● 10M02DCU169C8G: Lower-density alternative with 2,000 logic elements in the same 169-ball UBGA package, providing cost optimization for simpler control applications.
● 10M08SAU169I7G: Industrial temperature grade version rated for -40°C to +100°C operation, ideal for outdoor and harsh environment deployments requiring extended temperature range.
● Lattice ICE40HX4K: Competitor's low-power FPGA offering comparable logic capacity with ultra-low standby current for battery-operated applications requiring minimal power consumption.
● Intel Cyclone 10LP10: Performance upgrade path featuring 28nm technology with 35% lower power consumption and enhanced I/O capabilities, though requiring PCB redesign due to different FGG484 package.
ThisMAX 10 FPGA incorporates comprehensive security features including AES-128 bit encryption for configuration bitstream protection, JTAG Secure Mode to prevent unauthorized access, and One-Time Programmable (OTP) fuses for permanent security settings. The FPGA chip supports single-chip Nios II soft-core processor implementation, enabling complete embedded system integration without external processors. Power management features include a dedicated sleep mode that dramatically reduces standby current consumption, making the device suitable for battery-operated and power-sensitive applications. The flash-based configuration eliminates external boot memory costs while providing infinite reconfigurability for field upgrades and design iterations.
Alternative embedded ADC FPGAs
● 10M16SAU169C8G: Higher-density MAX 10 variant offering 16,000 logic elements with 98% pin compatibility, suitable for designs requiring expanded resources but introducing 40% higher static power consumption.
● 10M02DCU169C8G: Lower-density alternative with 2,000 logic elements in the same 169-ball UBGA package, providing cost optimization for simpler control applications.
● 10M08SAU169I7G: Industrial temperature grade version rated for -40°C to +100°C operation, ideal for outdoor and harsh environment deployments requiring extended temperature range.
● Lattice ICE40HX4K: Competitor's low-power FPGA offering comparable logic capacity with ultra-low standby current for battery-operated applications requiring minimal power consumption.
● Intel Cyclone 10LP10: Performance upgrade path featuring 28nm technology with 35% lower power consumption and enhanced I/O capabilities, though requiring PCB redesign due to different FGG484 package.
