Model No: 10M08SAU169A7G

Altera 10M08SAU169A7G

Manufacturer: Altera
SEMICON NO.: 10M08SAU169A7G
Package: 169-LFBGA
Stock: In stock
Description: MAX 10 FPGA IC 130 387072 8000
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 Mfr    Altera 
 Device Type  Non-Volatile FPGA
 Logic Elements (LEs) / Cells  8,000
 Logic Array Blocks (LABs)   500
 Total RAM Bits  387,072 bits
 Architecture  M9K embedded memory blocks
 Maximum I/O Pins   130
 Core Frequency   Up to 382 MHz
 I/O Standards Support   3.3V, 2.5V, 1.8V, 1.5V, 1.2V, and LVDS
 Supply Voltage 2.85 V to 3.465 V
 Operating Temperature -40°C to +125°C 
 Package 169-LFBGA
 Mounting Type Surface Mount
 Compliance    
 RoHS Compliant
10M08SAU169A7G MAX 10 FPGA 8000 LE
The 10M08SAU169A7G is a MAX® 10 FPGA from Intel (formerly Altera), featuring 8,000 logic elements (LEs), 378 Kbits of embedded memory, and integrated flash configuration memory—all in a single low-cost, single-chip solution. This device belongs to the 10M08"S"(single-supply) variant and is housed in a 169-pin UBGA (Ultra FineLine BGA) package measuring 11 mm × 11 mm with a 0.8 mm ball pitch. Operating from a single 3.3 V VCCIO supply for I/O banks and a 1.2 V core generated internally via an on-chip regulator (or supplied externally), the 10M08SAU169A7G is specified for industrial temperature range (–40 °C to +100 °C). It offers up to 101 user I/O pins across four I/O banks supporting 1.2 V to 3.3 V standards including LVCMOS, LVTTL, LVDS (up to 840 Mbps), and SSTL/HSTL for memory interfacing. With its integrated 8 Mbit (1 M × 8) user flash memory, built-in ADC (some variants), and instant-on configuration from on-chip NVM, the 10M08 is purpose-built for bridging, I/O expansion, power sequencing, motor drive control, and glue logic in industrial, automotive, and consumer systems that previously relied on CPLDs or discrete flash + FPGA combinations.
The 10M08SAU169A7G is widely adopted in applications that require instant-on, non-volatile configuration and moderate logic density:
● Industrial I/O expansion and CPLD replacement: consolidates address decoding, bus arbitration, level shifting, and state machines previously split across multiple CPLDs or PALs.
● Motor control and power-converter glue logic: generates PWM dead-time, decodes encoder signals, and sequences power-stage enable lines with deterministic latency.
● Sensor fusion / front-end preprocessing​: aggregates and formats data from multiple SPI/I²C/UART sensors before passing to a main MCU or processor.
● Display and interface bridging: converts between LVDS display panels and CMOS/TTL interfaces or acts as a LCD timing controller in cost-sensitive equipment.
Alternative FPGAa
● 10M08SAU169C8G: Same 10M08S device in 169-UBGA with commercial temperature range (0 °C to +85 °C) and –8 speed grade, offering a lower-cost option for non-extended-temperature applications.
● 10M08DCU169C8G: Dual-supply (core + I/O separate) version of the 10M08 in 169-UBGA; pin-compatible but requires separate 1.2 V core supply, useful when system already provides regulated 1.2 V core rail.
● 10M16SAU169A7G​: Larger MAX 10 variant with 16 K LEs, 549 Kbits RAM, and 56 multiplier blocks in the identical 169-UBGA footprint, providing a straightforward upgrade path with no PCB change.
● 10M04SAU169A7G: Smaller 4 K-LE member of the MAX 10 family in same 169-UBGA package, ideal when logic requirements are modest and cost reduction is prioritized.